User's Manual

6.4 I2C Master/ Slave

The MC17 embeds I2C hardware module, which could act as Master mode or Slave mode.

I2C is POPULAR inter-IC interface requiring only 2 bus lines, a serial data line (SDA) and a

serial clonk (SCL). M030 I2C module supports standard mode (100kbps), Fast-mode

(400kbps), Fast-mode plus (1Mbps) and High-speed mode (3.4Mbps) with restriction that

system clock must be by at least 10x of data rate. I2C module of the M030 acts as Slave

mode by default. I2C slave mode supports two sub modes including DMA and Mapping mode.

6.5 SPI

The MC17 embed SPI, which could act as Master mode or Slave mode. SPI is high-speed, full-

duplex and synchronous communication bus requiring 4bus lines including a chip select (CS)

line, a data input (DI) line, a data output (DO)line and a clock (CK) line. SPI for the M030 acts as

slave mode by default. SPI Slave mode support DMA.

. Layout and Soldering Considerations

.1 Soldering Recommendations

EH-MC17 is compatible with industrial standard reflow profile for Pb-free solders. The reflow

profile used is dependent on the thermal mass of the entire populated PCB, heat transfer

EH-MC17 Datasheet

efficiency of the oven and particular type of solder paste used. Consult the datasheet of

particular solder paste for profile configurations.

Comply will give following recommendations for soldering the module to ensure reliable solder

joint and operation of the module after soldering. Since the profile used is process and layout

dependent, the optimum profile should be studied case by case. The following recommendation

should be taken as a starting point guide.

z Refer to technical documentations of particular solder paste for profile configuration.

Avoid using more than one flow.

Reliability of the solder joint and self-alignment of the component are dependent on the

solder volume. Minimum of 150um stencil thickness is recommended.

Aperture size of the stencil should be 1:1 with the pad size.

A low residue, “no clean” solder paste should be used due to low mounted height of the

component.