Product Info

©Ehong Technology Co.,Ltd Page 3 of 15
Contents
1. Introduction ........................................................................................................................ 4
2. Quick Specifications ........................................................................................................... 4
3. Applications ........................................................................................................................ 5
4. Ordering Information .......................................................................................................... 5
5. Block Diagram .................................................................................................................... 5
6. Pin Descriptions ................................................................................................................. 6
6.1 Pin-out ............................................................................................................................ 6
6.2 Pin Descriptions .............................................................................................................. 6
7. Electrical Specifications ..................................................................................................... 8
7.1 Recommended Operation Conditions .............................................................................. 8
7.2 Module power consumption ............................................................................................. 8
8. Software/ Firmware ............................................................................................................ 9
9. Mechanical Data ................................................................................................................ 9
9.1 Dimensions ..................................................................................................................... 9
9.2 Recommended PCB Land Pads .................................................................................... 10
10. Physical Interfaces ....................................................................................................... 10
10.1 GPIO ............................................................................................................................. 10
10.2 UART ............................................................................................................................ 10
10.3 I2C Master/ Slave .......................................................................................................... 11
10.4 SPI ................................................................................................................................ 11
10.5 More interfaces ............................................................................................................. 11
11. RF Design Notes .......................................................................................................... 11
11.1 Recommended RF Layout & Ground Plane ................................................................... 11
11.2 Antenna Patterns .......................................................................................................... 12
11.2.1 90 degree direction ........................................................................................... 12
11.2.2 0 degree direction ............................................................................................. 12
12. Layout and Soldering ................................................................................................. 13
12.1 Layout ........................................................................................................................... 13
12.2 Layout Guidelines ......................................................................................................... 13
13. Development Kit ........................................................................................................... 13
14. Module power consumption test .................................................................................. 14
15. Communication distance .............................................................................................. 14
16. Related Documents ...................................................................................................... 14