Specifications
L506 Hardware Design 
Copyright©  Shanghai  Mobiletek  Communication  Ltd                                                              61 
Figure 6-3 The reference temperature curve 
6.3 The Moisture Sensitivity Level (MSL) 
L506    module  complies  with  the  humidity  level  3.  At  a  temperature  of  <30  degrees  and  relative 
humidity of <60% of  the environmental conditions, dry pack  to perform J-STD-020C specification 
according to IPC / JEDEC standard. At a temperature of <40 degrees and a relative humidity of <90% 
of  the  environmental  conditions,  in  the  case  of  unopened  shelf  life  of  at  least  six  months.  After 
unpacking,  Table  6-2  shows  the  module  shelf  life  at  different  times  corresponding  to  the  level  of 
humidity.   
Table6-2: Moisture sensitivity level and floor life 
The Moisture Sensitivity Level 
(MSL) 
Floor  Life(out  of  bag)  at  factory  ambient≦+30 
/60%RH 
1 
Unlimited at ≦+30 /85% 
2 
1 Year 
2a 
4 weeks 
3 
168 hours 
4 
72 hours 
5 
48 hours 
5a 
24 hours 
6 
Mandatory bake before use. After bake,it must be 
reflowed  within  the  time  limit  specified  on  the 
label. 
After unpacking,<30 degrees in temperature and relative humidity <60% environmental conditions, 
168 hours in the SMT patch. If not meet the above conditions need to be baked. 










