Data Sheet
Table Of Contents
EMC3080 Series Wireless Module Data Manual
Copyright of Shanghai MXCHIP Information Technology Co., Ltd.
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during which the IO is pulled to the high level is about 20ms.
Figure 3 IO The power-on state interface
5. The processing of chip pins inside the module is as follows:
⚫ PA_0, PA_1, PA_23: 10K pull-down resistor.
⚫ CHIP_EN: 100K pull-up resistor and 22nF capacitance to ground.Electrical Parameter