Data Sheet
Table Of Contents
- Abstract
- 1. Introduction
- 2. Characteristic
- 3. Pin Definition
- 4. System memory space
- 5. ATE（RF Test Mode）
- 5.1. ATE Command
- 5.1.1. Start MP mode
- 5.1.2. Stop MP mode
- 5.1.3. Set Tx rate
- 5.1.4. Set operational channel
- 5.1.5. Set operational bandwidth
- 5.1.6. Set Tx power
- 5.1.7. Set antenna for Tx
- 5.1.8. Set antenna for Rx
- 5.1.9. Start air Rx mode
- 5.1.10. Start continuous Tx mode
- 5.1.11. Query air Rx statistics
- 5.1.12. Reset air Tx/Rx statistics
- 5.2. Example Command
- 5.1. ATE Command
- 6. Flash Programing
- 7. Electrical parameters
- 8. Antenna Information
- 9. Assembly size and PCB package
- 10. Production Guidelines
- 11. FCC and IC Information
- 11.1. FCC Warning
- 11.2. IC warning
- 11.3. Trace antenna designs
- 11.4. RF exposure considerations
- 11.5. Antennas
- 11.6. Label and compliance information
- 11.7. Information on test modes and additional testing requirements5
- 11.8. Additional testing, Part 15 Subpart B disclaimer
- 11.9. The module is limited to OEM installation ONLY.
- 11.10. The OEM integrator is responsible for ensuring that the end-user has no manual instructions to remove or install module.
- 11.11. The module is limited to installation in mobile or fixed applications
- 12. Package and Label
- Appendix 1: Sales and Technical Support Information
EMC328x Series Wireless Module Data Manual
Copyright of Shanghai MXCHIP Information Technology Co., Ltd.
33
Upper
temperature
zone setting
135
150
170
175
180
215
250
260
247
200
Lower
temperature
zone setting
135
150
170
175
180
215
250
260
247
200
Figure 18 Typical secondary reflow profile
⚫ Preheating temperature rise from 30 ° C to 150 ° C: 0-3 ° C / s, typical value: 1.2 ° C / s
⚫ 150 ° C ~ 190 ° C immersion temperature: 60-100 seconds, typical value: 72 seconds
⚫ Peak temperature: 245 ° C, typical value: 242 ° C
⚫ Time above 220°C: 50 seconds to 90 seconds, typical value: 70 seconds
⚫ 217 ° C cooling rate: -3 ~ 0 ° C / s, typical value: -2.0 ° C / s