User's Manual

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5.2. Use guidelines(Please read carefully)
z Stamps Wi-Fi modules from MXCHIP must be soldered with SMT machine. After unpacking
and burn the firmware patch must be completed within 24, or to re-vacuum packaging, Must be
baking before patching the modules
 SMT need machine:
（1）Reflow soldering SMT machine
（2）The AOI detector
（3）6-8 mm diameter suction nozzle
 baking need equipment:
（1）Cabinet baking box
（2）The antistatic, high temperature resistant tray
（3）The antistatic high temperature resistant gloves
z Storage conditions as follows：
（1）Moisture bag must be stored in a temperature < 30 ° C, humidity 85% RH of the
environment.
（2）Dry packing products, the guarantee period should be from 6 months from the date of
Packing seal.
（3）Sealed packaging is equipped with humidity indicator card, as shown in Figure 11.