User's Manual

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1.1. Pinouts
EMW3081 uses DIP packages and stamps hole packages interface design，DIP packages（figure
2）can effectively reduce the risk of quality of secondary patch；Stamp hole packages（figure 3）
facilitate customers to debug and easy installation, designed to provide customers diversity selection.
Windows and solder pads have the same size，recommended SMT stencil thickness is
0.12mm-0.14mm.
Figure2.DIPpackagedimension
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Figure3.Stampholepackagesdimension