User's Manual
Table Of Contents
- RevisionHistory
- Introduction
- PackageInformation
- ApplicationInterfaceSpecification
- RFSpecification
- ReliabilityandOperatingCharacteristics
- GuideforProduction
- Appendix
Smart Machine Smart Decision
SIM5320AL_User Manual_V1.01 2014-08-20
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Figure 41: The ramp-soak-spike reflow profile of SIM5320AL
For details about secondary SMT, please refer to document [24].
6.3 Moisture Sensitivity Level (MSL)
SIM5320AL is qualified to Moisture Sensitivity Level (MSL) 5 in accordance with JEDEC J-STD-020.
After the prescribed time limit exceeded, users should bake modules for 192 hours in drying equipment
(<5% RH) at 40° C +5° C/-0° C, or 72 hours at 85° C +5° C/-5° C. Note that plastic tray is not
heat-resistant, users must not use the tray to bake at 85° C or the tray may be damaged.
6.4 Stencil Foil Design Recommendation
The recommended thickness of stencil foil is more than 0.15mm.