User's Manual

Smart Machine Smart Decision
SIM868_Hardware_Design_V1.00 55 2016-06-20
7. Manufacturing
7.1. Top and Bottom View of SIM868
Figure 42: Top and bottom view of SIM868
7.2. Typical Solder Reflow Profile
Figure 43: Typical solder reflow profile of lead-free process
7.3. The Moisture Sensitivity Level
The moisture sensitivity level of SIM868 module is 3. The modules should be mounted within 168 hours after
unpacking in the environmental conditions of temperature <30℃ and relative humidity of <60% (RH). It is
necessary to bake the module if the above conditions are not met: