Data Sheet

X-C13SG-0
802.11bgn and BLE SoC
Shanghai ChipFresh Internet of Things Technology Co., Ltd
14
6 Product Handling
6.1
Reflow Profile
Solder the module in a single reflow.
0 50
100 150 200 250
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s
Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 7LPH: 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃ /s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Time (sec.)
50
25
0
100
Ramp-up zone
1 ~ 3 ℃/s
Soldering time
> 30 s
Cooling zone
–1 ~ –5 ℃ /s
Reflow zone
>217 ℃ 60 ~ 90s
Preheating zone
150 ~ 200 ℃ 60 ~ 120 s
250
217
200
Peak Temp.
235 ~ 250 ℃
Figure 7. Reflow Profile
6.2 Storage Conditions
℃