Specifications

Shanghai Yancan Electronic Technology Co.,Ltd.
Dual Mode Bluetooth
5.2 Recommended PCB Footprint
Figure 6. Recommended PCB Footprint
N
ote:
1. The area of the product board under the module antenna needs to be clear of metal ground or traces.
2. The decoupling capacitor for 3P3VD input should be as close to the module as possible.
3. Strong interference line at the bottom of the module should be forbidden.