Service manual

FO-IS125N
5 – 6
CX95410-12Z (IC100) Terminal Description
2.1.2 Memory block
1) SST25VF016B (IC200): pin-8 SOIC (FLASH MEMORY)
16Mbit FLASH Memory.
Firmware for Fax Engine is stored in this device. All of the entry data,
user setting and so on are also stored.
2) EDS2516AFTA-75-E (IC202): pin-54 TSOP (SDRAM)
256Mbit (4M x 16bit x 4bank) Synchronous DRAM.
On power on sequence, the program stored in FLASH memory
(IC200) is loaded into this device. Then, this device is used as a pro-
gram execution memory. It is also used as various work memories and
communication buffer etc.
3) SST25VF016B (IC201, IC203, IC204, IC206): pin-8 SOIC
(FLASH MEMORY)
4 pieces of Flash memory are stored the image data of Fax sending
and receiving. Each device has 16Mbit of capacitor.
2.1.3 MODEM block
1) MODEM
The block is mainly composed of the G3 FAX modem CX95110
(IC1000), and is provided with the following modem function.
1) G3 FAX modem
The modem satisfies the requirements specified in ITU-T Recom-
mendations V.17, V.29, V.27 ter, and V.21, and meets the binary
signaling requirements of T.30. Internal HDLC support eliminates
the need for an external serial input/output (SIO) device in the DTE
for products incorporating error detection and T.30 protocol. The-
modem can perform HDLC framing per T.30 at all data speeds.
CRC generation/checking along with zero insertion/deletion
enhances SDLC/HDLC frame operations. Two FSK (V.21 Channel
1 and V.21 Channel 2) flag pattern detectors facilitate FSK detec-
tion during high-speed reception. The modem features a program-
mable DTMF transmitter/receiver and three programmable tone
detectors.
2) External Handset Support (Optional)
The modem can also provide access to the telephone line from an
external handset, when connected via a Conexant CX20548 Line
Side Device.
3) SmartDAA
The SmartDAA system-powered DAA operates reliably without
drawing power from the line, unlike line-powered DAAs that oper-
ate poorly when line current is insufficient due to long lines or poor
line conditions. Enhanced features such as monitoring of local
extension status without going off-hook are also supported. Incor-
porating Conexant’s proprietary Digital Isolation Barrier (DIB)
design and other innovative DAA features such as Digital PBX line
protection and status reporting, the SmartDAA architecture simpli-
fies application design, minimizes layout area, and reduces compo-
nent cost.
4) V.34 Half-Duplex Mode (SSF336)
The SSF336 modem satisfies the requirements specified in ITU-T
Recommendation V.34 half-duplex and meets the binary signaling
requirements of V.8 and T.30 with Annex F.
5) Features
• 2-wire half-duplex fax modem modes with send and receive
data rates up to 14,400 bps
- V.17, V.29, V.27 ter, and V.21 Channel 2
- Short train option in V.17 and V.27 ter
• HDLC support at all speeds
- Flag generation, 0-bit stuffing, ITU CRC-16 or CRC-32 calcula-
tion and generation
- Flag detection, 0-bit deletion, ITU CRC-16 or CRC-32 check
sum error detection
- FSK flag pattern detection during high-speed receiving
• Tone modes and features
- Programmable single or dual tone generation
- DTMF receiver
- Tone detection with three programmable tone detectors
• Auto-dial and auto-answer control
• Receive dynamic range:
- -3 dBm to -43 dBm for V.17, V.29, V.27 ter and V.21 Channel 2
• Caller ID (V.23, 1200 bps Rx) Demodulation
• ADPCM Voice Mode (Conexant proprietary)
• Programmable RLSD turn-on and turn-off thresholds
• Programmable transmit level: -4 to -15 dBm
• Digital speaker output to monitor received signal
• Two 16-byte FIFO data buffers for burst data transfer with
extension up to 255 bytes
• V.21 Channel 1 Flag detect
• V.21 Channel 2 Flag detect
• Support for external handset (voice conversation)
- Requires use of CX20548 LSD
• +3.3 V only operation
• 32-pin QFN package (HSD)
• Typical power consumption
- Normal mode: 264 mW
- Sleep mode: 59.4 mW
- Deep Sleep mode: 16.5 mW
• PRAM download capability
Pin
No.
Pad
No.
Side Pin Signal Name Pad Signal
Name
Pad
Type
Pad Cell Def.
I/O
Drv. Str.
(def.)
Hys PU / PD Description
169 186 T ADDR[7] m_addr[7] O plb03 O8 SDRAM Address
170 187 T ADDR[6] m_addr[6] O plb03 O8 SDRAM Address
171 188 T ADDR[5] m_addr[5] O plb03 O8 SDRAM Address
172 189 T ADDR[4] m_addr[4] O plb03 O8 SDRAM Address
173 190 T RTC_VDDO rtcvddo PWR pcb00rtc 3.3V Battery Power
174 191 T RTC_VSS rtcvsso GND pvsnnn Battery Ground
175 192 T RTC_XIN rtc_xin I pcb00rtc I 32 kHz Crystal/Oscillator input
176 193 T RTC_XOUT rtc_xout O pcb00rtc O 32 kHz Crystal output