User`s manual
Table Of Contents
- Safety Precautions
- Table of contents
- Chapter 1: Outline
- 1-1 Features
- 1-2 Controller
- 1-3 Measurement program
- [1] Positional deviation measurement
- [2] Degree of match inspection
- [3] Lead inspection
- [4] BGA/CSP inspection (IV-S32M/S33M)
- [5] Area measurement by binary conversion
- [6] Object counting by binary conversion
- [7] Object identification by binary conversion
- [8] Point measurements
- [9] Distance and angle measurement
- [10] Multiple position measurement (IV-S33M)
- [11] Multiple degree of match inspection (IV-S33M)
- Chapter 2 : Precautions for Use
- Chapter 3 : System Configuration
- Chapter 4 : Part Names and Functions
- Chapter 5 : Connection and Installation Methods
- Chapter 6 : Setting and Operating Outlines
- Chapter 7 : Simplified Menu Operation
- 7-1 Operation screen
- 7-2 Image display
- 7-3 Setting functions that are different with each controller
- 7-4 Setting procedures
- 7-5 Setting the operation conditions
- 7-6 Setting object types
- 7-7 Setting the shutter speed
- 7-8 Setting the positioning conditions
- 7-9 Setting the existence inspection conditions
- 7-10 Measurement triggering
- 7-11 Saving data
- 7-12 Specify the system conditions
- Chapter 8 : Specifications
- Chapter 9 : Operation Examples
- Glossary
- Appendix
- Alphabetical Index
1-8
Outline
1
[2] Degree of match inspection
Search area
for positioning
Search area
for positioning
Criterion image
for positioning
Criterion image
for positioning
Criterion image
for measuring object
Criterion image
for measuring object
▲
Good label
SERIAL NO.
8F053G26
MODEL
IV
-
S30
SERIAL NO.
8F053G26
MODEL
IV
-
S30
▲
NG label
Compare a good criterion image to a test image by inspecting matching levels using the
gray scale search function. (Determine whether the part is acceptable or NG by checking
similarities between the criterion image and the workpiece (test) image.)
A matching level comparison using binary images is also possible.
Pur-
pose
Exam-
ple
Appli-
cation
Detect positional deviation of labels, detect contamination of different parts, inspect the
mounting of electronic parts on PC boards, detect mis-prints, inspect for missing electric
parts such as terminals, and simple letter inspection.
[Detecting label deviations on packages]
- Inspection procedure
1 Conduct a gray scale search of the criterion image position
2 Correct the position of the object being measured from the coordinates for the
criterion image obtained in item 1 above.
3 If the matching level of the test image is low, the IV-S30 can determine that the
label position is NG.
[Measured results]
- Degree of match compared with the reference image
- Detected coordinates (X/Y) of the measurement image.
- Light level in the measured image (average light level/absolute value of difference)
[3] Lead inspection
Lead
[Lead inspection]
Pur-
pose
Exam-
ple
Based on positional information obtained from the gray scale search function, inspect the
condition of the IC leads and connector pins. (No. of lead pins that can be detected in one
image: Max. 128.)
Appli-
cation
Inspect the IC leads and connector pins
[Inspect the layout of the IC leads and connector pins]
K0 K1 K2 K3
D1D0
W0
W1 W2 W3
D2
L3
L0
L1
L2
Lead measure-
ment limit line
Reference line
- Inspection procedure
1 Determine the measurement points (K0 to K3) from the mid points of the leads and
the reference line.
2 Calculate the distances between the leads (D0 to D2) using the measurement points.
3 Calculate the lead lengths (L0 to L3) from the measurement points (K0 to K3) toward
the lead measurement limit line.
4 Calculate the lead widths (W0 to W3) centering the measurement points.
- Number of leads K
- D0 to D2: Distance
between leads
- W0 to W3: Lead width
- L0 to L3: Lead length