User`s manual

7-1
7
BGA/CSP Inspection
Chapter 7: BGA/CSP Inspection (IV-S32MX/S33MX)
The BGA/CSP inspection is available on the IV-S32MX/S33MX controllers.
7-1 Outline
The center of gravity, area of each label, number of labels and fillet diameter are
measured using the binary label measurement function.
Inspection of BGA/CSP solder balls
Purpose
Applications
Examples
[Measurement of 6 balls]
- Inspection sequence
Label 0 Label 1 Label 2
Label 5Label 4Label 3
Area of each label
Distance between label
centers of gravity
Binary
conversion
Ball size
Labeling (numbering)
Ball-to-ball distance
Number of balls
Image capture Center of gravity
measurement
Fillet diameter
DX0
FX
FY
DY0
[Measurement results]
- Number of objects: K
- Area oh each object: R0 to R127
- Distance between centers of gravity: (DX0, DY) to (DX127, DY127)
- Filet diameters: FX, FY