Specifications

58
Manual
ProtoMat 95s/II
Tip:
We recommend that you punch-mark small diameter holes before drilling.
The M
ARKING
D
RILLS
phase in BoardMaster is intended for this purpose and
uses a special universal milling cutter, the "
UNIVERSAL CUTTER
0,2
MM FOR
MARKING
".
•
Vitrification of the drilled hole
occurs as a result of the board material melting when
the drill remains in the hole too long after the hole has been made.
These holes then cause problems for through-hole plating.
Reduce drilling times as appropriate.
•
Drills may break
where the drilling base has already been used a number of times.
The drilling base should be changed for each new board.
The drill may break if it comes into contact with the edge of an existing hole in the
base.
Broken tools must be removed from the PCB and the drilling base. Very thin drills may
also break if the tool is too high above the material.
•
Milling passes
created during film milling will be uneven if there is air still trapped
under the film.
The film may buckle after a while if elastic adhesive tape
is used to secure the film.
It is particularly important that the milling base is flat (LPKF engraving film backing).
•
Burrs
will be produced when milling film if either the tool is blunt or milling is too deep.
•
Uniform misalignment
between the solder and component sides occurs where the
HOME position has not been programmed accurately.
•
Increasing misalignment in the x-axis
between the solder and component sides
occurs where the registration hole system is no longer parallel to the x-axis.
A new registration hole system will have to be drilled.