Specifications

DX-BT24-S MODULE SPECIFICATION
Shenzhen DX-SMART Technology Co., Ltd. www.szdx-smart.com
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Figure 18：Recommended reflow soldering temperature profile
Table 15：Recommended reflow soldering temperature
Statistics name Lower limit Upper limit unit
Slope 1 (target=2.0) is between 30.0 and 70.0 1 3 Degree/sec
Slope 2 (target=2.0) is between 70.0 and
150.0
1 3 Degree/sec
Slope 3 (target = -2.8) is between 220.0 and
150.0
-5 -0.5 Degree/sec
Constant temperature time 110-190℃ 60 120 sec
@220℃ Reflow time 30 65 sec
Peak temperature 235 250 Celsius
@235℃ total time 10 30 sec
5.4. Packing Specification
The DX-BT24-S Bluetooth module is packaged in a pallet and sealed in a vacuum-sealed bag
with a desiccant and humidity card in the vacuum-sealed bag. Each tray is long mm * wide mm *