Specifications

DX-BT24-T MODULE SPECIFICATION
Shenzhen DX-SMART Technology Co., Ltd. www.szdx-smart.com
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5. Patch Requirements
5.1. Storage Conditions
Modules are shipped in vacuum sealed bags. The humidity sensitivity level of the module is 3
(MSL 3), and its storage must comply with the following conditions：
1. Recommended storage conditions: temperature 23±5°C, and relative humidity 35~60%.
2. Under the recommended storage conditions, the module can be stored in a vacuum sealed
bag for 12 months.
3. Under workshop conditions with a temperature of 23±5°C and a relative humidity of less than
60%, the workshop life of the module after unpacking is 168 hours. Under this condition, the
module can be directly subjected to reflow production or other high-temperature
operations. Otherwise, the module needs to be stored in an environment with a relative
humidity of less than 10% (for example, a moisture-proof cabinet) to keep the module dry.
4. If the module is under the following conditions, the module needs to be pre-baked to prevent
the PCB from blistering, cracks and delamination that occurs after the module absorbs
moisture and gets wet and then solders at a high temperature：
 Storage temperature and humidity do not meet the recommended storage conditions；
 The module failed to complete production or storage according to Article 3 above after
unpacking；
 Vacuum packaging leaks, bulk materials；
 Before module repair;
5.2. Module Baking Treatment
 Requires high temperature baking at 120 ±5 °C for 8 hours；

The second-baked module must be soldered within 24 hours after baking, otherwise
it still needs to be stored in a dry box；