Specifications

DX-BT24-T MODULE SPECIFICATION
Shenzhen DX-SMART Technology Co., Ltd. www.szdx-smart.com
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Remark
1. In order to prevent and reduce the occurrence of defective welding such as blistering and
delamination caused by damp, strict control should be carried out. It is not recommended to
expose to the air for a long time after unpacking the vacuum package.
2. Before baking, take the module out of the package and place the bare module on a high
temperature resistant appliance to avoid high temperature damage to the plastic tray or reel；
The second-baked module must be soldered within 24 hours after baking, otherwise it must be
stored in a dry box. Please pay attention to ESD protection when unpacking and placing the
module, for example, wear anti-static gloves。
5.3. Reflow Soldering
Use a printing squeegee to print the solder paste on the screen so that the solder paste is
printed on the PCB through the opening of the screen. The force of the printing squeegee needs
to be adjusted appropriately.In order to ensure the quality of the module printing paste, the
thickness of the stencil corresponding to the module pad part is recommended to be
0.1~0.15mm .
The recommended reflow soldering temperature is 235~250 ºC, and the maximum should
not exceed 250 ºC。In order to avoid damage to the module due to repeated heating, it is strongly
recommended that customers re-attach the module after completing the reflow soldering on the
first side of the PCB board. The recommended furnace temperature curve (lead-free SMT reflow
soldering) and related parameters are shown in the chart below：