Specifications

DX-BT24-T MODULE SPECIFICATION
Shenzhen DX-SMART Technology Co., Ltd. www.szdx-smart.com
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5.3. Reflow Soldering ................................................................................................................................. - 24 -
5.4. Packing Specification ......................................................................................................................... - 25 -
Table index
Table 1 ：Basic parameter table ...............................................................................................................- 6 -
Table 2 ：Pin definition description table............................................................................................. - 8 -
Table 3 ：Work mode table....................................................................................................................... - 9 -
Table 4 ：Power interface pin definition table ...................................................................................- 10 -
Table 5 ：RST pin definition table ......................................................................................................... - 12 -
Table 6 ：RST pin definition .................................................................................................................... - 12 -
Table 7 ：KEY Pin definition table ..........................................................................................................- 13 -
Table 8 ：KEY pin function definition table ........................................................................................ - 13 -
Table 9 ：Absolute maximum rating table..........................................................................................- 18 -
Table 10 ：Working voltage table..........................................................................................................- 18 -
Table 11 ：Working and storage temperature table ........................................................................- 18 -
Table 12 ：Power consumption table ................................................................................................... - 19 -
Table 13 ：RF characteristics table........................................................................................................ - 19 -
Table 14 ：Table of ESD withstand voltage of module pins ...........................................................- 20 -
Table 15 ：Recommended reflow soldering temperature..............................................................- 25 -
Picture index
Figure 1 ：Functional block diagram ..................................................................................................- 6 -
Figure 2 ：Module pin definition ......................................................................................................... - 7 -
Figure 3 ：Energy-saving mode control diagram ........................................................................- 10 -
Figure 4 ：Burst transmission power supply requirements .....................................................- 11 -
Figure 5 ：powered reference circuit ............................................................................................... - 11 -
Figure 6 ：Reset reference circuit ......................................................................................................- 12 -
Figure 7 ：Key reset reference circuit .............................................................................................. - 12 -
Figure 8 ：Open-collector drive wake-up reference circuit .................................................... - 13 -
Figure 9 ：Key reset reference circuit .............................................................................................. - 14 -
Figure 10 ：IIC communication sequence diagram .................................................................... - 15 -
Figure 11 ：SPI communication timing diagram ..........................................................................- 16 -
Figure 12 ：Typical application circuit ............................................................................................. - 17 -
Figure 13 ：Reference circuit for serial port level conversion ................................................- 17 -
Figure 14 ：Module top and side dimension drawing ...............................................................- 20 -
Figure 15 ：Bottom view size of the module .................................................................................- 21 -
Figure 16 ：Recommended package dimensions ........................................................................ - 21 -
Figure 17 ：Top and bottom views of the module ......................................................................- 21 -
Figure 18 ：Reference position for module placement .............................................................- 22 -
Figure 19 ：Recommended reflow soldering temperature profile ...................................- 25 -
Figure 20 ：Pallet size (unit: mm) .......................................................................................................... - 26 -
Figure 21 ：Packing box size (unit: mm) ............................................................................................. - 26 -