Specifications

Ra-01SC Specification V1.1

6. Design guidance

6.1

Application Circuit

（1） In addition to the SPI interface, the communication interface with the master MCU must

also connect BUSY/DIO1 to the IO port of the master MCU

（2） If the antenna is soldered on the main control board, it is recommended to reserve a Π

matching circuit at the antenna interface.

6.2

Recommended module package design size

Note

：

This is the package drawing of the Ra-01SC module. It is recommended to design the

PCB board according to this drawing so that the module can work normally on the PCB board;

and when designing the pads, pay attention to the design of the pads on the PCB. The pad is

retracted and offset, and the PCB pad is expanded relative to the module pad without affecting

the use of the module.

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