Product Specification Reversion v1.0 Date 2017-03-14 Model Name BL-M7603NU4 Product Name IEEE 802.11b/g/n (2T2R) WLAN USB Module Blink Approve Field ENGINEER QC SALES Customer Approve Field ENGINEER 联系人：邓海兵 QC MANUFACTORY MO:13662644686 0 PDF pdfFactory Pro www.fineprint.
Content Content ................................................................................................................................................... 1 1. General Description.............................................................................................................................. 2 2. Applications ......................................................................................................................................... 2 3. Product Specification...............
1. General Description BL-M7603NU4 is a highly integrated Wi-Fi single chip which support 300 Mbps PHY rate. It fully complies with IEEE802.11n and IEEE802.11b/g standard, offering feature-rich wireless connectivity at high standard, and delivering reliable, cost-effective throughput from an extended distance. Optimized RF architecture and baseband algorithms provide superb performance and lower power consumption.
Host Interface USB2.0 Standard IEEE 802.11b, IEEE 802.11g,IEEE 802.11n Frequency Range 2.4GHz~2.4835GHz Modulation Type 802.11b: CCK, DQPSK, DBPSK 802.11g: 64-QAM,16-QAM, QPSK, BPSK 802.11n: 64-QAM,16-QAM, QPSK, BPSK Working Mode Infrastructure, Ad-Hoc Data Transfer Rate 1,2,5.5,6,11,12,18,22,24,30,36,48,54,135,300 Mbps(self-adapting) Spread Spectrum IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum) IEEE 802.
Frequency 2412 - 2484MHz Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps DC Characteristics min TX mode 170 Rx mode Sleep mode Typ max unit 230 480 mA 95 105 109 mA 58 60 65 mA Specification : IEEE802.11n Mode OFDM Frequency 2412 - 2484MHz Data rate 6.5, 13, 19.5, 26, 39, 135,300Mbps DC Characteristics min Typ max unit TX mode 165 220 450 mA Rx mode 95 105 110 mA Sleep mode 58 60 65 mA 4 PDF pdfFactory Pro www.fineprint.
3.4 Product Photo 3.5 Mechanical Specification Module dimension: Typical (W x L x H): 27.0mmx17.7mmx2.0mm 5 PDF pdfFactory Pro www.fineprint.cn Tolerance : +/-0.
3.6 ProductPinDefinition 6 PDF pdfFactory Pro www.fineprint.
4. Supported platform 7 PDF pdfFactory Pro www.fineprint.
Operating System CPU Framework Driver WIN2000/XP/VISTA/WIN7 X86 Platform Enable LINUX2.4/2.6 ARM, MIPSII Enable WINCE5.0/6.0 ARM ,MIPSII Enable 5.Typical Application Circuit 8 PDF pdfFactory Pro www.fineprint.
Figure 5 Typical application circuit NOTE： 1. RF trace need to keep 50ohm impedance 6. Package information 7. Typical Solder Reflow Profile 9 PDF pdfFactory Pro www.fineprint.
8. Precautions for use 1. Plus handle the module under ESD protection. 2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature 245℃. 3.Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity < 70% RH, over 96 hours. Baking condition: 125 degree C, 12 hours Baking times: 1 time 4. Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH.
FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi s device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’ s authority to operate the equipment.
Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular.
