Users Manual

ManualsBrandsShenZhen BiLian Electronic ManualsElectronicsIEEE 802.11a/b/g/n 300Mbps WLAN + Bluetooth 5.0 Combo Module

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11 http://www.b-link.net.cn

6. Reflow Soldering Standard Conditions

Please use the reflow within 2 times.

Set up the highest temperature within 250℃.

7. Key Components Of Module

No.

Parts

Specification

Manufacturer

Note

1

Chipset

MT7638BUN

Mediatek

2

PCB

BL-M7638BU4

Shenzhen Tie Fa Technology limited

Guangdong KINGSHINE ELECTRONICS

CO., LTD

Quzhou Sunlord Electronics Co., Ltd

3

Crystal

240MHz-10pF-10ppm-322

5

HUBEI TKD ELECTRONICS

TECHNOLOGY CO., LTD.

LUCKI CM ELECTRONICS CO., LTD

HOSONIC ELECTRONIC CO., LTD.

SHENZHEN KAIYUEXIANG

ELECTRONICS CO., LTD