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802.11a/b/g/n/ac 867Mbps WLAN + Bluetooth v5.1 USB Combo Module
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Table Of Contents
1.Introduction
The BL-M7663BU3 is a highly integrated 2T2R 802.11
1.1Features
1.2Block Diagram
1.3General Specifications
2.Pin Assignments
2.1Pin Definition
3.Electrical and Thermal Specifications
3.1Recommended Operating Conditions
3.2 Current Consumption
4.WLAN & Bluetooth RF Specifications
4.12.4G WLAN RF Specification
4.25G WLAN RF Specification
4.3Bluetooth RF Specification
5.Mechanical Specifications
5.1Module Outline Drawing
5.2Mechanical Dimensions
6.Application Information
6.1Typical Application Circuit
6.2Recommend PCB Layout Footprint
6.3 Reflow Soldering Standard Conditions
7.Key Components Of Module
8.Package and Storage Information
8.1Package Dimensions
8.2Storage Conditions
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http://www
.b-link.net.c
n
6.
1
Recommend
PCB
Layout
Footprint
Bottom
V
iew
6.
2
Reflow
Soldering
Standard
Conditions
Please
use
the
reflow
within
2
time
s.
Set
up
the
highest
temper
ature
withi
n
250℃
.
6.
Application
Information
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