Specifications

ManualsBrandsShenZhen BiLian Electronic ManualsElectronicsIEEE 802.11 a/b/g/n/ac(1T1R)WLAN with Bluetooth Module

BL-M8821CS1

SPECIFICATION

IEEE 802.11 a/b/g/n/ac 1T1R WLAN with Bluetooth2.1/4.2 with SDIO and

HS-UART MIXED INTERFACE

Version: 1.0

Customer

Date

Model Name BL-M8821CS1

Part NO.

Blink Approve Field

ENGINEER

SALES

Customer Approve Field

ENGINEER

MANUFACTORY

PURCHASING

Summary of content (12 pages)

PAGE 1
BL-M8821CS1 SPECIFICATION IEEE 802.11 a/b/g/n/ac 1T1R WLAN with Bluetooth2.1/4.2 with SDIO and HS-UART MIXED INTERFACE Version: 1.0 Customer Date Model Name BL-M8821CS1 Part NO.
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B-LINK ELECTRONIC CO., LTD in shenzhen Contents 1. General Description.............................................................................................................................. 2 2. The range of applying ........................................................................................................................... 2 3. Product Specification............................................................................................................................ 2 3.
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B-LINK ELECTRONIC CO., LTD in shenzhen 1. General Description BL-M8821CS1 is a small size and low profile of WiFi+BT combo module with LGA (Land-Grid Array) footprint, board size is 12mm*12mm with module height of 2.35mm. It can beeasily manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products. It provides GSPI/SDIO interface for WiFi to connect with host processor and high speed UART interface for BT.
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B-LINK ELECTRONIC CO., LTD in shenzhen 3.2 Electrical and Performance Specification Item Description Product Name Major Chipset BL-M8821CS1 RTL8821CS Host Interface SDIO 1.1/ 2.0/ 3.0 Standard WiFi: IEEE802.11a, IEEE802.11b, IEEE802.11g, IEEE802.11n, IEEE802.11ac, BT: BT V2.1 BR+EDR, BT V3.0+HS, BT V4.0 LE+ BR/EDR , BT V4.1, BT V4.2 Frequency Range Modulation Type Working Mode Data Transfer Rate Spread Spectrum Sensitivity @PER RF Power(Typical) BT:2.402~2.48GHz(BT) 2.4GWIFI:2.412~2.
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B-LINK ELECTRONIC CO., LTD in shenzhen Working Temperature -10°C to +50°C Storage temperature -40°C to +85°C 3.3Power Supply DC Characteristics Vcc=3.3V，Ta= 25 °C，unit: mA Supply current Standby (RF disabled) 802.11b Typ. Max 82 89 1Mbps 11Mbps Supply current Typ. Max. Typ. Max. TX mode 350 335 330 320 RX mode 90 95 92 96 802.11g 6Mbps 54Mbps Supply current Typ. Max. Typ. Max. TX mode 250 235 120 110 RX mode 90 94 95 98 802.
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B-LINK ELECTRONIC CO., LTD in shenzhen 3.4 Product Photo TOP Bottom 3.5 Mechanical Specification Tolerance: +-0.
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B-LINK ELECTRONIC CO., LTD in shenzhen 3.6 Product Pin Definition Pin No： Function Description 1 GND Grond 2 WIFI/BT_ANT WIFI/BT_ANT 3 GND Grond 4,5 NC NC 6 BT_WAKE HOST wake-up Bluetooth device 7 BT_HOST_WAKE Bluetooth device to wake-up HOST 8 NC NC 9 VABT Battery LDO input,5.5V-2.8V 10,11 NC NC Shared with GPIO9 This Pin Can Externally Shutdown the 12 WL_DSI# RTL8821CS WLAN function when WL_DIS# is Pulled Low. When this pin pulled low, SDIO interface will be disabled.
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B-LINK ELECTRONIC CO., LTD in shenzhen 23 NC NC 24 SUSCLK_IN Shared with EECS. External 32K or RTC clock input 25 PCM_DOUT PCM Data output 26 PCM_CLK PCM Clock 27 PCM_DIN PCM data input 28 PCM_SYNC PCM sync signal 29,30 NC NC 31 GND Grond 32 NC NC 33 GND Grond Shared with GPIO11 This Pin Can Externally Shutdown 34 BT_DIS# the RTL8821CS WLAN function when BT_DIS#is Pulled Low. When this pin pulled low, UART interface will be also disabled.
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B-LINK ELECTRONIC CO., LTD in shenzhen 5. Peripheral Schematic Reference Design 6.
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B-LINK ELECTRONIC CO., LTD in shenzhen 7. Typical Solder ReflowProfile 8. Precautions for use 1. Pls handle the module under ESD protection. 2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature 245℃. 3.Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity < 70% RH, over 96 hours. Baking condition: 125 degree C, 12 hours Baking times: 1 time 4.
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FCC Statement This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) thi s device may not cause harmful interference, and (2) this device must accept any interference received, incl uding interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’ s authority to operate the equipment.
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Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular transmitter 2.3 Specific operational use conditions This module is stand-alone modular.