Product Info

DS-2472-01 <Rev.0.0>
page 33/ 63
5.2. Package Soldering
5.2.1. Background
The DKL 1908_V.1 is housed in a small 16-pin lead-free QFN 3x3 mm
2
package. DKL 1908_V.1 can also be
packaged as 12 pin or 8 pin SOP package. The packaged part passes the Level 3 pre-condition testing.
5.2.2. Reference Reflow Temperature Profile
Figure 18
is the reference temperature profile for the SMD IR reflow. Different equipments may have different
optimized reflow conditions for maximum yield.
Pb-free SMD Package IR Reflow Profile
Figure 18. Reference SMD Package IR Reflow Profile
Step# Profile Feature Condition / Duration
Step 1 Ramp-up rate
1.5-3℃ /sec
Step 2
Preheat : 150~ 200℃ (Ta-Tb)
t1-t2: 60~80 sec
Step 3
Ramp-up rate (T
L
to T
P
)
1.5-3℃ /sec
Temperature maintained above 220℃ (T
L
)
t
L
: 80~150 sec
Step 4
Peak temperature (T
P
)
260+0/-5℃
Time within 5℃ of actual peak temperature
30±10 sec
Step 5 Ramp-down rate
6℃/sec. Max.
Note1: Time 25℃ to peak temperature: 8 minutes max.
Note2: The time between reflows shall be 5 minutes minimum and 60 minutes maximum.