Product Info
DS-2472-01 <Rev.0.0> page 5/ 63
Table of Content
Applications .......................................................................................................................................... 3
Introduction ......................................................................................................................................... 3
Features ............................................................................................................................................... 4
1. Pin Configuration .............................................................................................................................. 9
1.1. Device Pin Assignments ............................................................................................................ 9
1.2. Device Pin Descriptions .......................................................................................................... 10
2. Electrical Characteristics ................................................................................................................... 11
2.1. Absolute Maximum Ratings ..................................................................................................... 11
2.2. Recommended Operating Conditions ....................................................................................... 11
2.3. DC Characteristics .................................................................................................................. 11
2.4. ESD Characteristics ................................................................................................................ 12
2.5. AC Characteristics .................................................................................................................. 12
2.5.1. Receiver ...................................................................................................................... 12
2.5.2. Transmitter .................................................................................................................. 12
2.5.3. Synthesizer .................................................................................................................. 12
2.6. Power-on and External Reset Characteristics ............................................................................ 13
2.7. Crystal Parameter Specifications .............................................................................................. 13
3. Functional Description ..................................................................................................................... 14
3.1. PHY ...................................................................................................................................... 14
3.1.1. State Machine Control ................................................................................................... 16
3.2. MAC ..................................................................................................................................... 17
3.2.1. MAC Frame Format ....................................................................................................... 18
3.2.2. Destination address ...................................................................................................... 19
3.2.3. TXMAC ........................................................................................................................ 19
3.2.4. RXMAC ........................................................................................................................ 20
3.2.5. Auto Acknowledgement ................................................................................................. 20
3.3. Memory ................................................................................................................................ 21
3.3.1. Registers ..................................................................................................................... 22
3.3.2. FIFOs .......................................................................................................................... 22
3.4. Power Management ............................................................................................................... 23
3.4.1. Power Supply Scheme ................................................................................................... 23
3.4.2. Power Saving Modes ..................................................................................................... 23
3.5. Interface ............................................................................................................................... 24
3.5.1. SPI .............................................................................................................................. 24
3.5.2. Interrupt Signal ............................................................................................................ 27
4. Application Guide ............................................................................................................................ 28
4.1. Initialization .......................................................................................................................... 28
4.2. Change Channel .................................................................................................................... 29
4.3. RF Channel Fine Tunning ........................................................................... ......................... 29
4.4. Interrupt .................................................................................................. ......................... 29
4.5. TX ........................................................................................................................................ 30