Specifications

ManualsBrandsShenzhen Elenose Technology ManualsAudio EquipmentBone conduction wireless earphone

Table Of Contents

HM3216ANT2450-HM02_V1.0

Page

of 8

深圳市恒信达通信科技有限公司

Shenzhen HengXinDa Technology Co., Ltd.

SPECIFICATION

Ceramic Antenna 3216 Size

2400-2500 MHz

P/N: HXD-BT5-HM02

Summary of content (8 pages)

PAGE 1
深圳市恒信达通信科技有限公司 Shenzhen HengXinDa Technology Co., Ltd. SPECIFICATION Ceramic Antenna 3216 Size 2400-2500 MHz P/N: HXD-BT5-HM02 HM3216ANT2450-HM02_V1.
PAGE 2
深圳市恒信达通信科技有限公司 Shenzhen Hengxinda Technology Co., Ltd. 1. Frequency 2400-2500 MHz 2. Applications For Miniaturized Bluetooth System 3. Dimensions (Unit : mm) 1). Over View : 2).PCBLYOUT VIEW: HXD-BT5-HM02_V1.
PAGE 3
深圳市恒信达通信科技有限公司 Shenzhen Hengxinda Technology Co., Ltd. 4. Evaluation Board Size and Matching Circuits 4.7 nH 0.5 pF 5. Electrical Characteristics Part Number HM3216ANT2450-HM02 Central Frequency 2450 MHz Bandwidth 100(typ.) MHz V.S.W.R ≤2.0 Peak Gain 4.34 dBi Impedance 50 Ohm Polarization Linear Azimuth Beamwidth Omni-directional HXD-BT5-HM02_V1.
PAGE 4
深圳市恒信达通信科技有限公司 Shenzhen Hengxinda Technology Co., Ltd. 6. Return Loss (S11) 7. Radiation Pattern & Efficiency Frequency (MHz) 2400 2450 2500 Efficiency (dB) -1.87 -1.67 -1.94 Efficiency (%) 65 68 64 3.12 4.34 3.45 Gain (dBi) HXD-BT5-HM02_V1.
PAGE 5
深圳市恒信达通信科技有限公司 Shenzhen Hengxinda Technology Co., Ltd. 8. Reflow Soldering Standard Condition 9. Packaging and Dimensions  Plastic Tape HXD-BT5-HM02_V1.
PAGE 6
深圳市恒信达通信科技有限公司 Shenzhen Hengxinda Technology Co., Ltd.  Remarks for Package Reserve a length of 150~200mm for the trailer of the carrier and 250~300 mm for the leader of the carr er and further 250mm of cover tape at the leading part of the carrier.  Reel (6000 pcs/Reel)  Storage Period Oxidizable Material, 12 months in vacuum sealed bag, please repack within 168 hours by re-seal the package treatment after using. Storage Temperature Range : <30 degree C, Humidity : <60%RH HXD-BT5-HM02_V1.
PAGE 7
深圳市恒信达通信科技有限公司 Shenzhen Hengxinda Technology Co., Ltd. 10. Dependability Test Test item Test condition / Test method Specification Solderability *Solder bath temperature：240±5℃ At least 95% of a surface of each IEC 60068-2-58 *Immersion time：2±0.5 sec terminal electrode must be covered GB/T2423.28 Solder：Sn96.5Ag3.0Gu0.5 for by fresh solder. lead-free.
PAGE 8
深圳市恒信达通信科技有限公司 Shenzhen Hengxinda Technology Co., Ltd. Bending test The middle part of substrate shall be No mechanical damage. IEC 60068-2-21 pressurized by means of the pressurizing rod Electrical specification shall satisfy the GB/T 2423.29 at a rate of about 1 mm/s per second until the descriptions in electrical characteristics at deflection becomes 2mm and then pressure the room temperature. shall be maintained for 10±1 sec.