Specifications

深圳市恒信达通信科技有限公司
Shenzhen Hengxinda Technology Co., Ltd.
HXD-BT5-HM02_V1.0
Page
7
of 8
10. Dependability Test
Test item
Test condition / Test method
Specification
Solderability
IEC 60068-2-58
GB/T2423.28
*Solder bath temperature：240±5℃
*Immersion time：2±0.5 sec
Solder：Sn96.5Ag3.0Gu0.5 for
lead-free.
At least 95% of a surface of each
terminal electrode must be covered
by fresh solder.
Leaching (Resistance
to dissolution of
metallization)
JIS C5101
*Solder bath temperature：260±5℃
*Leaching immersion time：10±1 sec
Solder : Sn96.5 Ag3.0 Gu0.5 for
lead-free.
Loss of metallization on the edges of
each electrode shall not exceed 25%.
Resistance to
soldering heat
IEC 60068-2-58
GB/T2423.28
*Preheating temperature：120~150℃, 1
minute.
*Solder temperature：260±5℃
*Immersion time：10±1 sec Solder：
Sn96.5Ag3.0Gu0.5 for lead-free
Measurement to be made after keeping
at room temperature for 24±2 hrs.
No mechanical damage.
Electrical specification shall satisfy
the descriptions in electrical
characteristics at the room
temperature.
Loss of metallization on the edges of
each electrode shall not exceed 25%.
Drop Test
IEC 60068-2-32
GB/T2423.8
Customer’s
specification.
*Height：50 cm
*Test Surface: Rigid surface of concrete or
steel.
*Times：6 surfaces for each units；2 times for
each side.
No mechanical damage.
Electrical specification shall satisfy the
descriptions in electrical characteristics at
the room temperature.
Vibration
IEC 60068-2-6
GB/T 2423.10
*Frequency：10Hz~55Hz~10Hz(1min)
*Total amplitude：1.5mm
*Test times：6hrs.(Two hrs each in three
mutually perpendicular directions)
No mechanical damage.
Electrical specification shall satisfy the
descriptions in electrical characteristics at
the room temperature.
Adhesive Strength of
Termination
IEC60068-2-21
GB/T 2423.6
*Pressurizing force：
5N(≦0603)；10N(>0603)
*Test time:10±1 sec
No remarkable damage or removal of the
termination.