User's Manual

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Preambles
The module supports standard IEEE802.11 b/g/n agreement, complete TCP/IP protocol
stack. Users can use the add modules to an existing device networking, or building a
separate network controller.
ESP8266 is high integration wireless SOCs, designed for space and power constrained
mobile platform designers. It provides unsurpassed ability to embed Wi-Fi capabilities
within other systems, or to function as a standalone application, with the lowest cost, and
minimal space requirement.
ESP8266 offers a complete and self-contained Wi-Fi networking solution; it can be
used to host the application or to offload Wi-Fi networking functions from another
application processor.
When ESP8266EX hosts the application, it boots up directly from an external flash. In
has integrated cache to improve the performance of the system in such applications.
Alternately, serving as a Wi-Fi adapter, wireless internet access can be added to any
micro controllerbased design with simple connectivity (SPI/SDIO or I2C/UART interface).
ESP8266 is among the most integrated WiFi chip in the industry; it integrates the
antenna switches, RF balun, power amplifier, low noise receive amplifier, filters, power
management modules, it requires minimal external circuitry, and the entire solution,
including front-end module, is designed to occupy minimal PCB area.
ESP8266 also integrates an enhanced version of Tensilica’s L106 Diamond series 32-bit
processor, with on-chip SRAM, besides the Wi-Fi functionalities. ESP8266EX is often
integrated with external sensors and other application specific devices through its GPIOs;
codes for such applications are provided in examples in the SDK.
1. Features
• 802.11 b/g/n
• Integrated low power 32-bit MCU
• Integrated 10-bit ADC
• Integrated TCP/IP protocol stack
• Integrated TR switch, balun, LNA, power amplifier and matching network
• Integrated PLL, regulators, and power management units
• Supports antenna diversity
• Wi-Fi 2.4 GHz, support WPA/WPA2
• Support STA/AP/STA+AP operation modes
• Support Smart Link Function for both Android and iOS devices
• SDIO 2.0, (H) SPI, UART, I2C, I2S, IRDA, PWM, GPIO
• STBC, 1x1 MIMO, 2x1 MIMO
• A-MPDU & A-MSDU aggregation and 0.4s guard interval
• Deep sleep power < 5uA
• Wake up and transmit packets in < 2ms
• Standby power consumption of < 1.0mW (DTIM3)
• +20dBm output power in 802.11b mode
• Operating temperature range -40C ~ 85C