User's Manual

720 Hardware User Guide

7 Mounting and Packaging

7.1 Mounting the Module onto the Application Board

N720 is compatible with industrial standard reflow profile for lead-free SMT process.

The reflow profile is process dependent, so the following recommendation is just a start point

guideline:

 Only one flow is supported.

 Quality of the solder joint depends on the solder volume. Minimum of 0.12 mm to 0.15stencil

thickness is recommended.

 Use bigger aperture size of the stencil than actual pad size.

 Use a low-residue, no-clean type solder paste.

For information about cautions in N720 storage and mounting, refer to Neoway Module Reflow

Manufacturing Recommendations.

When you maintain and manually solder it, use heat guns with great opening, adjust the

temperature to 250 degrees (depending on the type of the solder paste), and heat the module till

the solder paste is melt. Then remove the module using tweezers. Do not shake the module in

high temperature when you remove it. Otherwise, the components inside the module might be

misplaced.

7.2 Package

N720 modules are packaged in sealed bags on delivery to guarantee a long shelf life. Package

the modules again in case of opening for any reasons.

If exposed in air for more than 48 hours at conditions not worse than 30°C/60% RH, a baking

procedure should be done before SMT. Or, if the indication card shows humidity greater than

20%, the baking procedure is also required. Do not bake modules with the package tray directly.