User's Manual

N
720 Hardware User Guide
Copyright © Neoway Technology Co., Ltd 40
8 SMT TemperatureCurve
Figure 8-1 Temperature curve
X: Time (s) Y Temperature (°C)
Technicalparameters:

Ramp up rate: 1to 4°C/sec; Ramp down rate: -3 to-1°C/sec

Soaking zone: 150-180°CTime: 60-100s

Reflow zone:>220°CTime: 40-90s

Peak temperature: 235-250°C
It is not recommended that you use the kind of solder paste different from our module technique.

The melting temperature of solder paste with lead is 35°Clower than that of solder paste
without lead. It is easy to cause faulty joints for BGA inside the module after second reflow
soldering.

If you can use only solder pastes with lead, please ensure that the reflow temperature is kept
at 220°C for more than 45 seconds and the peak temperature reaches 240°C.
Neoway will not provide warranty for heat-responsive element abnormalities caused by improper
temperature control.