Datasheet

Shuttle Computer Handels GmbH (European Headquarters), Fritz-Strassmann-Str. 5, D-25337 Elmshorn, Germany, Tel. [phone], Fax [phone], [e-mail], www.shuttle.eu
2013-05-06
B
a
re
b
o
n
e
M
o
d
el
Di
m
ensions
L
W
H in c
m
Volume in litre
Chipset
CPU socket max. Wattage CPU Heat-pipe SD card reader max. Memory (1) Half Full Combo
m
SATA
Mini
PCIe
Slots
Drive
Bays
5.25” Slim 2.5” int.
SATA 3Gb/s
USB
3.0
Front Rear
F
r
o
nt
Rear
O
nb
o
ar
d
USB
2.0
Graphics Ports
G
igabit L
A
N
COM (serial)
Audio
Power adapter
VESA mount
Vertical Stand
Operating Temperature
XH61V
24 x 20 x 7.2 3.5 Intel H61
LGA1155
65W
–
2x 8GB, SO-DIMM
DDR3-1333
1 / 1 / – /
1 / 2 3 – / 2 4 / 2 / 2
HDMI
DVI-I
2 2
5.1-ch
SPDIF
90 W
<35°C
DS61
V1.1
18 x 16.5 x 4.3 1.35 Intel H61
LGA1155
65W
2x 8GB, SO-DIMM
DDR3-1333
– / – / 1 /
- / 1 2 – / 2 2 / - / 6
HDMI
DVI-I
2 2 2-ch 90 W
– <50°C
XH61V DS61 V1.1 (6)
Front
panel
Back
panel
= available or supported, = optional accessories for XH61V V1.1: PS01 = Vertical Stand, PV02 = VESA mount
1. Memory modules that are designed for higher frequencies can also be used. The installed modules then run at the maximum supported frequency.
2. The listed products feature a heat-pipe cooling system and high-quality solid capacitors (except the audio part).
3. The listed products feature two RS232 serial ports with optional 5V/12V auxiliary voltage setting. One port can also be configured as RS422 or RS485.
4. The HDMI output supports multi-channel digital audio signal.
5. 22nm Ivy Bridge processors are supported.
6. Comparison: DS61 versus DS61 v1.1: Version 1.1 features two additional USB 2.0 connectors at the front panel.
Shuttle Slim-PCs (LGA1155)