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Data sheet 6AG1155-5AA00-2AC0

SIPLUS ET 200MP IM 155-5 PN HF -40...+60 °C With conformal

coating based on 6ES7155-5AA00-0AC0 . PROFINET IO device

interface module IM 155-5 PN HF, for ET 200MP electronic modules;

Up to 12 IO modules without PS; Up to 30 IO modules with additional

PS; Integrated 2-port switch; RJ45 shared device; MRP; IRT >=0.25

ms; Isochronous mode FW update; IM0...3; Prioritized run-up S2

redundancy; Shared device with 4 controllers

General information

Product type designation IM 155-5 PN HF

HW functional status E01

Firmware version V1.0.0

Vendor identification (VendorID) 0x002A

Device identifier (DeviceID) 0X0312

Product function

● I&M data

Yes; I&M0 to I&M3

Engineering with

● STEP 7 TIA Portal configurable/integrated as of

version

V13 / V13

● STEP 7 configurable/integrated as of version

V5.5 SP3 / -

● PROFINET as of GSD version/GSD revision

V2.3 / -

Supply voltage

Rated value (DC) 24V

permissible range, lower limit (DC) 19.2V

permissible range, upper limit (DC) 28.8V

Reverse polarity protection Yes

Short-circuit protection Yes

6AG1155-5AA00-2AC0 Subject to change without notice

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Summary of content (5 pages)

PAGE 1
Data sheet 6AG1155-5AA00-2AC0 SIPLUS ET 200MP IM 155-5 PN HF -40...+60 °C With conformal coating based on 6ES7155-5AA00-0AC0 . PROFINET IO device interface module IM 155-5 PN HF, for ET 200MP electronic modules; Up to 12 IO modules without PS; Up to 30 IO modules with additional PS; Integrated 2-port switch; RJ45 shared device; MRP; IRT >=0.25 ms; Isochronous mode FW update; IM0...
PAGE 2
Mains buffering ● Mains/voltage failure stored energy time 20 ms Input current Current consumption (rated value) 0.2 A Power Infeed power to the backplane bus 14 W Power available from the backplane bus 2.3 W Power loss Power loss, typ. 4.5 W Address area Address space per module ● Address space per module, max. 256 byte; per input / output Hardware configuration System power supply can be plugged in to left of IM Yes Number of permissible power segments 3 Rack ● Modules per rack, max.
PAGE 3
— Shared device Yes — Number of IO Controllers with shared device, max. 4 Redundancy mode ● MRP Yes ● MRPD Yes ● PROFINET system redundancy (S2) Yes Open IE communication ● TCP/IP Yes ● SNMP Yes ● LLDP Yes Isochronous mode Isochronous operation (application synchronized up to terminal) Yes Equidistance Yes shortest clock pulse 125 µs max.
PAGE 4
● horizontal installation, max. 60 °C; = Tmax Altitude during operation relating to sea level ● Installation altitude above sea level, max. 5 000 m ● Ambient air temperature-barometric pressurealtitude Tmin ... Tmax at 1 140 hPa ... 795 hPa (-1 000 m ... +2 000 m) // Tmin ... (Tmax - 10 K) at 795 hPa ... 658 hPa (+2 000 m ... +3 500 m) // Tmin ... (Tmax -20 K) at 658 hPa ... 540 hPa (+3 500 m ... +5 000 m) Relative humidity ● With condensation, tested in accordance with IEC 60068-2-38, max.
PAGE 5
● Qualification and Performance of Electrical Insulating Compound for Printed Board Assemblies according to IPC-CC-830A Yes; Conformal coating, Class A Dimensions Width 35 mm Height 155 mm Depth 120 mm Weights Weight, approx.