Brochure

SIMATIC ET 200SP 21
Interface modules
The interface module connects the ET 200SP to PROFINET and
exchanges data between the higher-level controller and the
I/O modules. The variable bus adapter (BA) is simply plugged
into the interface module and enables free selection of the
connection system:
• IM 155-6PN Standard incl. server module
6ES7 155-6AU00-0BN0
• IM 155-6PN Standard incl. server module and
mounted bus adapter 2xRJ45
6ES7 155-6AA00-0BN0
SIPLUS versions
The interface modules and the I/O modules listed below are
also available as SIPLUS components for the extended temper-
ature range of -40 to +70°C and corrosive atmosphere / con-
densation.
(For details, visit: www.siemens.com/siplus-extreme)
I/O modules
The I/O modules are 1-, 2-, 4-, 8- and 16-channel, and they
permit scalable and cost-optimized design of the ET 200SP.
Digital and analog input/output modules are available:
Communication modules
There will also be an AS-Interface master communication
module. This AS-i master makes it possible to connect simple
field devices via AS-Interface to the ET 200SP. The AS-i master
is characterized by an extremely small size, meets specifica-
tion V3.0, and enables connection of up to 62 nodes.
In order to expand the AS-i network with safety-oriented com-
munication (ASIsafe), the AS-i safety module can be inserted
in addition to the AS-i master without any additional wiring.
This means that as many as 31 safety-related sensors and ac-
tuators are possible in each AS-i network (SIL3 according to EN
62061 and PL e according to ISO 13849).
The new IO-Link master module of SIMATIC ET 200SP inte-
grates the fast and simple IO-Link communication with sen-
sors and actuators into the established PROFINET or PROFIBUS
field bus system.
The new IO-Link master is based on the current IO-Link speci-
fication V1.1. and allows not only the IO-Link device parame-
ters, but also the master parameters to be stored consistently.
This means that when a device is replaced, the current param-
eters are automatically transferred into the replaced IO-Link
device – without any additional effort by the user. In addition,
a replacement of the master module is possible without PG/PC
and without the data being restored by the user. Moreover,
the IO-Link master offers shorter response times, thanks to
support of COM3. It goes without saying that IO-Link devices
according to specification V1.0 continue to be supported.
Function Order No. group
Digital input DI 8x24 V DC Standard 6ES7 131-6BF.
Digital input DI 16x24 V DC Standard 6ES7 131-6BH.
Digital output DQ 4x24V DC/2A Standard 6ES7 132-6BD.
Digital output DQ 8x24V DC/0.5A Standard 6ES7 132-6BF.
Digital output DQ 16x24V DC/0.5A Standard 6ES7 132-6BH.
Function Order no. group
Analog input AI 4xI 2-/4-wire Standard 6ES7 134-6GD.
Analog input AI 4xU/I 2-wire Standard 6ES7 134-6HD.
Analog input AI 4xRTD/TC 2-/3-/4-wire,
high-feature
6ES7 134-6JD.
Analog output AQ 4xU/I Standard 6ES7 135-6HD.
The TIA Selection Tool can be found on the Internet at
www.siemens.com/tia-selection-tool
or in the Industry Mall and also in the Catalog CA01 on DVD
SIMATIC_ET200_ENGLISCH.book Seite 21 Montag, 26. November 2012 10:02 10
© Siemens AG 2012