Data Sheet for Product

Point Map

Rev. 1, February, 2002

Siemens Building Technologies, Inc. Page 1 of 4

Document No. 127-0555

Systems Integration

APOGEE

Open Processor with McQuay Microtech

Driver: Direct Fired, Heating and Cooling (DC-S)

Absorption Chiller

Table 1. Direct Fired, Heating and Cooling (DC-S) Absorption Chiller.

Point Type Description Range/Units

01 LAO Device Address —

02 LAO Application Number 5053

03 LAI Unit Model Number See Table 2

04 LAI Communication Error 0 = Error

1–255 = No Error

05 LAI Chilled Water Temperature Set Point

°F

06 LAI Chilled Water Inlet Temperature °F

07 LAI Chilled Water Outlet Temperature °F

08 LAI Condensed Refrigerant Temperature °F

09 LAI Cooling Water Inlet Temperature °F

10 LAI Cooling Water Outlet Temperature °F

11 LAI Exhaust Gas Temperature °F

14 LAI High Temperature Generator Temperature °F

15 LAI Low Temperature Generator Temperature °F

16 LAI Hot Water Temperature Set Point °F

18 LAI Hot Water Inlet Temperature °F

20 LAI Hot Water Outlet Temperature °F

21 LAI Inverter Output Signal Hz

22 LAI Remote Reset Current Signal mA

25 – 26 LAI Unit Starts —

27 – 28 LAI Absorbent Pump 1 Starts —

29 – 30 LAI Burner Starts —

31 – 32 LAI Refrigerant Pump Starts —

33 – 34 LAI Unit Operating Hours ——

continued on next page...

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Point Map Rev. 1, February, 2002 Systems Integration APOGEE¥ Open Processor with McQuay Microtech Driver: Direct Fired, Heating and Cooling (DC-S) Absorption Chiller Table 1. Direct Fired, Heating and Cooling (DC-S) Absorption Chiller.
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Table 1. Direct Fired, Heating and Cooling (DC-S) Absorption Chiller.
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Table 1. Direct Fired, Heating and Cooling (DC-S) Absorption Chiller. Point Type Description Range/Units 77 LDI Refrigerant Pump Automatic Function Disabled/Enabled 78 LDI Refrigerant Pump Manual Function Disabled/Enabled 79 LDI SVRP Valve. Used for Simultaneous Chillers/Heaters to Drain Refrigerant from Condenser Sump. Off/On 80 LDI SVRU Valve. Used for Simultaneous Chillers/Heaters to Drain Refrigerant from Evaporator Sump.
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Information in this document is based on specifications believed correct at the time of publication. The right is reserved to make changes as design improvements are introduced. Other product or company names mentioned herein may be the trademarks of their respective owners. © 2002 Siemens Building Technologies, Inc. Siemens Building Technologies, Inc. 1000 Deerfield Parkway Buffalo Grove, IL 60089-4513 U.S.A. Printed in the U.S.A. Document No.