User's Manual Part 1
Table Of Contents
- Titel
- SIMATIC Sensors RFID systems SIMATIC RF300
- Legal Information
- Table of contents
- 1 Introduction
- 2 Safety information
- 3 System overview
- 4 RF300 system planning
- 4.1 Fundamentals of application planning
- 4.1.1 Selection criteria for SIMATIC RF300 components
- 4.1.2 Transmission window and read/write distance
- 4.1.3 Width of the transmission window
- 4.1.4 Impact of secondary fields
- 4.1.5 Permissible directions of motion of the transponder
- 4.1.6 Operation in static and dynamic mode
- 4.1.7 Dwell time of the transponder
- 4.1.8 Communication between communication module, reader (with IQ-Sense interface) and transponder
- 4.1.9 Calculation example (IQ-Sense)
- 4.1.10 Communication between communication module, reader (with RS422 interface) and transponder
- 4.1.11 Calculation example (RS422)
- 4.2 Field data for transponders, readers and antennas
- 4.3 Relationship between the volume of data and the transponder speed
- 4.4 Installation guidelines
- 4.5 Chemical resistance of the transponders
- 4.6 EMC Directives
- 4.1 Fundamentals of application planning
- 5 Readers
- 5.1 Overview
- 5.2 RF310R with IQ-Sense interface
- 5.2.1 Features
- 5.2.2 Pin assignment of RF310R IQ-Sense interface
- 5.2.3 Display elements of the RF310R reader with IQ-Sense interface
- 5.2.4 Ensuring reliable data exchange
- 5.2.5 Metal-free area
- 5.2.6 Minimum distance between RF310R readers
- 5.2.7 Technical data for RF310R reader with IQ-Sense interface
- 5.2.8 FCC information
- 5.2.9 Ordering data of RF310R with IQ-Sense interface
- 5.2.10 Dimension drawing
RF300 system planning
4.6 EMC Directives
SIMATIC RF300
System Manual, 09/2007, J31069 D0166-U001-A5-7618
83
4.6.7 Equipotential bonding
Potential differences between different parts of a plant can arise due to the different design
of the plant components and different voltage levels. If the plant components are connected
across signal cables, transient currents flow across the signal cables. These transient
currents can corrupt the signals.
Proper equipotential bonding is thus essential.
● The equipotential bonding conductor must have a sufficiently large cross section (at least
10 mm
2
).
● The distance between the signal cable and the associated equipotential bonding
conductor must be as small as possible (antenna effect).
● A fine-strand conductor must be used (better high-frequency conductivity).
● When connecting the equipotential bonding conductors to the centralized equipotential
bonding strip (EBS), the power components and non-power components must be
combined.
● The equipotential bonding conductors of the separate modules must lead directly to the
equipotential bonding strip.
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Figure 4-34 Equipotential bonding (EBS = Equipotential bonding strip)
The better the equipotential bonding in a plant, the smaller the chance of interference due to
fluctuations in potential.
Equipotential bonding should not be confused with protective earthing of a plant. Protective
earthing prevents the occurrence of excessive shock voltages in the event of equipment
faults whereas equipotential bonding prevents the occurrence of differences in potential.