Hardware Integration Guide AirPrime AR7592 41110461 0.
Hardware Integration Guide Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost.
Hardware Integration Guide Patents This product may contain technology developed by or for Sierra Wireless Inc. This product includes technology licensed from QUALCOMM®. This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from InterDigital Group and MMP Portfolio Licensing. Copyright © 2016 Sierra Wireless. All rights reserved.
Hardware Integration Guide Document History Version Date Updates 0.1 January 16, 20167 Creation 41110461 Rev 0.
Contents 1. INTRODUCTION .................................................................................................. 9 1.1. General Features .............................................................................................................. 9 1.2. Power ................................................................................................................................ 9 1.3. RF ................................................................................................
Hardware Integration Guide 7. ABBREVIATIONS .............................................................................................. 31 41110461 Rev 0.
List of Figures Figure 1. AppCAD Screenshot for Microstrip Design Power Mode Diagram ................................. 22 Figure 2. RF Routing Examples ..................................................................................................... 23 Figure 3. Coplanar Clearance Example ......................................................................................... 23 Figure 4. Antenna Microstrip Routing Example .........................................................................
List of Tables Table 1. AirPrime AR759x Series Embedded Modules .................................................................. 9 Table 2. AirPrime AR759x Series Supported Carrier Aggregation Combinations 1 ......................... 9 Table 3. Power Supply Requirements ............................................................................................. 9 Table 4. Power Supply Pads .........................................................................................................
1. Introduction 1.1. General Features The AirPrime AR7592 embedded modules are designed for the automotive industry. They support LTE, WCDMA air interface standards and shares hardware and firmware interfaces with the AirPrime AR755x and AR758x. They also have Global Navigation Satellite System (GNSS) capabilities including GPS and GLONASS. The AirPrime AR7592 embedded modules are based on the Qualcomm MDM9640 wireless chipset and support the following bands. Table 1.
Hardware Integration Guide Table 4. Introduction Power Supply Pads Pad Name Direction Function If Unused EA2 VBATT Input Power Supply Input Must Be Used EB2 VBATT Input Power Supply Input Must Be Used EC2 VBATT Input Power Supply Input Must Be Used 1.3. RF This section presents the WWAN RF interface of the AirPrime AR7592. The specifications for the LTE, GSM and WCDMA interfaces are defined. 1.3.1.
Hardware Integration Guide Table 6. Introduction Conducted RX (Receive) Sensitivity – GSM/EDGE Bands GSM/EDGE Bands GSM 850 PCS 1900 Limit (dBm) 1 Room Typical (dBm) Class A (Extreme) Typical (dBm) 2 Class A Limit (dBm) 2% BER CS CS -102 -109 tbd -103 10% BLER GMSK CS1 -104 Tbd tbd -105 10% BLER EDGE MCS5 -98 Tbd tbd -99 2% BER CS CS -102 -108.
Hardware Integration Guide Introduction Band Limit (dBm) 2 Room Typical (dBm) Class A (Extreme) Typical (dBm) 3 Class A Limit (dBm) B5 -104.7 -110.5 Tbd -105.5 B6 -106.7 -110.5 tbd -107.5 1 1: CS 0.1% BER 12.2 kbps 2 Per 3GPP specification 3 Test at Class A extreme condition Table 9. Conducted Secondary RX (Receive) Sensitivity – UMTS Bands1 Band Room Typical (dBm) Class A (Extreme) Typical (dBm) 2 Class A Limit ( dBm) B2 tbd tbd -105.5 B4 tbd tbd -107.5 B5 tbd tbd -105.
Hardware Integration Guide Introduction Note 2: Per 3GPP TS 36.521-1 6.2.2 UE Maximum Output Power ( No MPR);and for B13,Per VzW’s Supplementary_RF_Conformance. 2.1 Maximum Output Power – No MPR Or A-MPR Note 3: Class A is defined in 3.3 Environmental Note 4: For transmission bandwidths (Figure 5.4.2-1 in 3GPP TS 36.521-1) confined within FUL_low and FUL_low + 4 MHz or FUL_high – 4 MHz and FUL_high, the maximum output power requirement is relaxed by reducing the lower tolerance limit by 1.5 dB. 1.3.3.2.
Hardware Integration Guide Introduction Room Typical (dBm) Class A (Extreme)Typical (dBm) 1 Class A Limit (dBm) 1 Primary Secondary Primary Secondary Primary Secondary B7 -96.5 -97.5 tbd tbd -92 -92 B12 -98 -99 tbd tbd -91 -91 B13 -97 -98 tbd tbd -91 -91 B17 -98 -99 tbd tbd -91 -91 Band 1: Class A is defined in 3.3 Environmental 1.3.4. WWAN Antenna Interface The WWAN Antenna Interfaces of the AirPrime AR759x Series are defined in the table below. Table 13.
Hardware Integration Guide Parameter Introduction Requirements Comments Measured at the RF connector. Total radiated efficiency of Ant1 or Ant2 > 50% on all bands Maximum antenna gain Must not exceed antenna gains due to RF exposure and ERP/ EIRP limits, as listed in the module’s FCC grant. Includes mismatch losses, losses in the matching circuit, and antenna losses, excluding cable loss.
Hardware Integration Guide 1.4. Introduction GNSS The AirPrime AR759x Series include optional Global Navigation Satellite System (GNSS) capabilities via the Qualcomm gpsOne Gen8C Engine, capable of operation in assisted and stand-alone modes using GPS, GLONASS, Beidou, Galileo, and QZSS SVs. Note: Galileo support pending system / satellite deployment. 1.4.1. GNSS Receiver The table below summarizes the GNSS capabilities of the AirPrime AR759x Series. Table 15.
Hardware Integration Guide Introduction Note 4: Best performances are obtained by using external Pre-SAW and LNA for conducted test setup, it is used to simulate the active antenna as customer’s application. Note 5: 1Hz Navigation used for all tracking/navigation tests. Note 6: GNSS constellations used: GPS + GLONASS + Galileo + Beidou Note 7: Accuracy data are provided Circular Error Probable, CEP-50 / CEP-95.
Hardware Integration Guide Introduction Parameter Min Max Units ±8 kV ± 1.5 kV ESD Ratings ESD1 Primary, Secondary and GNSS antenna pads – Contact - All other signal pads – Contact - 1 The ESD Simulator configured with 150pF, 330Ω. Caution: The AirPrime AR759x Series are sensitive to Electrostatic Discharge. ESD countermeasures and handling methods must be used when handling the AirPrime AR759x Series. 1.5.2.
Hardware Integration Guide Caution: Introduction Digital IOs shall not be pulled-up to an external voltage as this may cause VCC_1V8 to not go low when the AirPrime AR759x Series are powered down. Also, this would partially bias the AirPrime AR759x Series which could potentially damage the device or result in GPIOs being set to undetermined levels. The SDIO characteristics are defined in the table below. Table 19. Digital IO Characteristics for SDIO VCC=1.
Hardware Integration Guide Introduction The UICC characteristics are defined in the table below. Table 21. Digital IO Characteristics for UICC_VCC=1.8V Nominal Parameter Comments Min Typ Max Units VIH High level input voltage CMOS/Schmitt 0.7* UICC_VCC – UICC_VCC + 0.3 V VIL Low level input voltage CMOS/Schmitt -0.3 – 0.
2. Audio Specification 2.1. Digital Audio The AirPrime AR759x Series provides two 4-wire digital audio interfaces. Each interface can be configured as either a PCM or an I2S interface. Table 23.
3. Routing Constraints and Recommendations Layout and routing of the AirPrime AR759x Series in the application is critical to maintaining the performance of the radio. The following sections provide guidance to the developer when designing their application to include an AirPrime AR759x Series and achieve optimal system performance. 3.1.
Hardware Integration Guide Routing Constraints and Recommendations Poor routing Correct routing The yellow traces cross the RF trace. There is no signal around the RF path. Figure 2. RF Routing Examples Fill the area around the RF traces with ground and ground vias to connect inner ground layers for isolation. Cut out ground fill under RF signal pads to reduce stray capacitance losses. Avoid routing RF traces with sharp corners. A smooth radius is recommended. E.g.
Hardware Integration Guide Routing Constraints and Recommendations RF Connector GND GND 50 Ohm Controlled Impedance Trace GND GND GND GND GND AR759x ANT GND GND GND Figure 4. 3.2.
Hardware Integration Guide 3.4. Routing Constraints and Recommendations Antenna Recommendations Connecting the antenna ground reference to the vehicle chassis is not recommended since that has been known to cause noise from the engine to couple into the audio of the device. It is ultimately up to the integrator to evaluate this performance. 3.5. Interface Circuit Recommendations The recommended interface implementation is to use a dual-supply bus transceiver with configurable voltage translation.
4. Firmware and Tools The AirPrime AR7592 are designed based on Qualcomm’s MDM9240 chipset, which contains a Modem Processor for running modem firmware components and an Application Processor for running embedded Linux applications. Various tools are provided by Qualcomm and developed by Sierra Wireless for developing and commercializing the AirPrime AR7592. 4.1.
5. Approval 5.1. Important Notice Because of the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost.
Hardware Integration Guide Approval 4.0 dBi in LTE Band 13 4.0 dBi in LTE Band 17 3. The AR7592 modem may transmit simultaneously with other collocated radio transmitters within a host device, provided the following conditions are met: Each collocated radio transmitter has been certfied by FCC / IC for mobile application. At least 20 cm separation distance between the antennas of the collocated transmitters and the user’s body must be maintained at all times.
Hardware Integration Guide Approval Note: If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093 and IC RSS-102. 5.4. IC Regulations This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two conditions: 1. This device may not cause interference; and 2.
6. References The table below lists the reference specifications for this product. Table 24. Ref Reference Specifications Title Rev Issuer [1] 3GPP TS 51.010-1 Version 7.3.1 3GPP [2] 3GPP TS 34.121-1 V8 3GPP [3] 3GPP TS 36.521-1 V9 3GPP [4] Universal Serial Bus Specification V2.0 USB Implementers Forum [5] Universal Serial Bus CDC Subclass Specification for Wireless Mobile Communication Devices V1.
7. Abbreviations The table below lists several abbreviations used in this document. Table 25.
