AirPrime Module Datasheet
Table Of Contents
- 1: Introduction
- 2: Physical Characteristics
- 3: Audio Circuit
- 4: Hardware Design Guidelines
- 5: Power Supply Sequencing
- 6: GPIO Electrical Specifications
- 7: Solder Reflow Profile
- A: Regulatory Certifications
- B: Packaging Dimensions
Rev 1 Apr.17 30
41110693
7
7: Solder Reflow Profile
The solder profile is described below.
Figure 7-1: Solder Profile
Zone A: Preheat: This raises the temperature at a controlled rate, typically 0.5 - 2C/s.
This will preheat the component to 120°C to 150°C to distribute the heat uniformly to
the PCB.
Zone B: Equilibrium1: In this zone, the flux becomes soft and uniformly spreads
solder particles over the PCB board, preventing re-oxidisation. The recommended
temperature for this zone is 150°C to 200°C for 60s to 120s.
Zone C: Equilibrium2: This is optional and in order to resolve the upright component
issue. Temperature is 210°C to 217°C for 20s to 30s.
Zone D: Reflow zone: The temperature should be high enough to avoid wetting but
low enough to avoid component deterioration. The recommended peak temperature is
230°C to 250°C. The soldering time should be 30s to 90s when the temperature is
above 217°C.
Zone E: Cooling: The cooling rate should be fast to keep the solder grains small
which will give a longer lasting joint. A typical cooling rate is 4°C/s.