AirPrime IoT Module Technical Specification Rev9 0

4115834 Rev 9.0 August 28, 2017 39
Product Technical Specification
Reliability Specification
Designation
Condition
Component Solder Wettability
CSW
Standard: JESD22 – B102, Method 1/Condition C, Solderability Test
Method
Special conditions: Test method: Dip and Look Test with Steam
preconditioning 8 h ± 15min. dip for 5 +0/-0.5 seconds
Operating conditions: Un-powered
Duration: 1 day
Moist Heat Cyclic Test
MHCT
Standard: IEC 60068-2-30, Test Db
Special conditions:
Upper temperature: +40 ± 2°C
Lower temperature: +25 ± 5°C
RH:
Upper temperature: 93%
Lower temperature: 95%
Number of cycles: 21 (1 cycle/24 hours)
Temperature Variation: 3 ± 0.6°C/min
Operating conditions: Powered ON for 15 minutes during each 3 hours
ramp up and 3 hours ramp down (in middle) for every cycle
Duration: 21 days
6.2.4. Thermal Resistance Cycle Stress Tests
The following tests the AirPrime HL7518 module’s resistance to extreme temperature cycling.
Table 29. Thermal Resistance Cycle Stress Tests
Designation
Condition
Thermal Shock Test
TSKT
Standard: IEC 60068-2-14, Test Na
Special conditions:
Temperature: -30°C to +80°C
Temperature Variation: less than 30s
Number of cycles: 600
Dwell Time: 10 minutes
Operating conditions: Un-powered
Duration: 9 days
Temperature Change
TCH
Standard: IEC 60068-2-14, Test Nb
Special conditions:
Temperature: -40°C to +90°C
Temperature Variation: 3 ± 0.6°C/min
Number of cycles: 400
Dwell Time: 10 minutes
Operating conditions: Un-powered
Duration: 29 days