AirPrime HL7548 and HL7588 Product Technical Specification 4116369 9.
Product Technical Specification Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost.
Product Technical Specification Patents This product may contain technology developed by or for Sierra Wireless Inc. This product includes technology licensed from QUALCOMM®. This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from MMP Portfolio Licensing. Copyright © 2017 Sierra Wireless. All rights reserved.
Product Technical Specification Document History Version Date Updates October 07, 2014 Creation December 01, 2014 Updated: • 2 Pad Definition • Table 10 VGPIO Electrical Characteristics • Figure 11 EMC and ESD Components Close to the SIM Removed section 6 X-Ray Exposure January 08, 2015 1.0 January 29, 2015 Updated: • 1.7 ESD • The note in section 3.2 Current Consumption Updated: • 1.8.2 Regulatory • Table 8 Current Consumption • 3.
Product Technical Specification Version Date Updates Updated: • Table 2 General Features • 3.7 Electrical Information for Digital I/O • 3.16.3 TX_ON Indicator (TX_ON) 2.1 May 18, 2015 2.2 May 19, 2015 Added PCM in section 3.7 Electrical Information for Digital I/O 3.0 July 13, 2015 Updated: • Signal names from PWR_ON to PWR_ON_N, and RESET_IN to RESET_IN_N • Figure 2 Mechanical Overview • 2 Pad Definition • 3.14 PCM • Figure 8 PWR_ON_N Sequence with VGPIO Information 3.
Product Technical Specification Version Date Updates 6.4 September 19, 2016 Updated: • PWR_ON_N pull up resistor value from 47kΩ to 100kΩ • 5.4.1 Using UART1 • 7.2 IC Statement 7.0 February 03, 2017 Updated: • Table 2 General Features • 3.14 PCM 7.1 February 15, 2017 Updated the Protocol Stack row of Table 2 General Features 8.
Contents 1. INTRODUCTION ................................................................................................ 12 1.1. Common Flexible Form Factor (CF3) ................................................................................12 1.2. Physical Dimensions .........................................................................................................13 1.3. General Features .........................................................................................................
Product Technical Specification 3.16.2. 3.16.3. RF Performances .....................................................................................................36 TX_ON Indicator (TX_ON).......................................................................................36 4. MECHANICAL DRAWINGS ............................................................................... 37 5. DESIGN GUIDELINES ....................................................................................... 39 5.1.
List of Figures Figure 1. Architecture Overview ..................................................................................................... 15 Figure 2. Mechanical Overview ...................................................................................................... 16 Figure 3. Pad Configuration ............................................................................................................ 24 Figure 4. PCM Timing Waveform ..............................................
List of Tables Table 1. Supported Bands/Connectivity ........................................................................................ 12 Table 2. General Features ............................................................................................................ 13 Table 3. ESD Specifications .......................................................................................................... 17 Table 4. Environmental Specifications ..............................................
Product Technical Specification Table 38. Handling Resistance Stress Tests .................................................................................. 47 Table 39. IC IDs ............................................................................................................................... 50 Table 40. Approved Antenna Types ................................................................................................ 50 Table 41. Ordering Information ................................
1. Introduction This document is the Product Technical Specification for the AirPrime HL7548 and HL7588 Embedded Modules. It defines the high-level product features and illustrates the interfaces for these features. This document is intended to cover the hardware aspects of the product, including electrical and mechanical. The AirPrime HL7548 and HL7588 belong to the AirPrime HL Series from Essential Connectivity Module family.
Product Technical Specification 1.2. Introduction Physical Dimensions AirPrime HL7548 and HL7588 modules are compact, robust, fully shielded modules with the following dimensions: • Length: 23 mm • Width: 22 mm • Thickness: 2.5 mm • Weight: 3.5 g Note: Dimensions specified above are typical values. 1.3. General Features The table below summarizes the AirPrime HL7548 and HL7588 features. Table 2.
Product Technical Specification Feature SIM interface Application interface Introduction Description • • • • • • Dual SIM Single Standby (DSSS) 1.
Product Technical Specification Feature Introduction Description • • • • Connectivity • • • • Multiple (up to 20) cellular packet data profiles Sleep mode for minimum idle power draw Mobile-originated PDP context activation / deactivation Support QoS profile ▪ Release 97 – Precedence Class, Reliability Class, Delay Class, Peak Throughput, Mean Throughput ▪ Release 99 QoS negotiation – Background, Interactive, and Streaming Static and Dynamic IP address.
Product Technical Specification 1.5. Introduction Interfaces The AirPrime HL7548 and HL7588 modules provide the following interfaces and peripheral connectivity: • 1x – 8-wire UART for the HL7588; 4-wire UART for the HL7548 • 1x – Active Low RESET • 1x – USB 2.0 • 1x – Backup Battery Interface • 2x – System Clock Out • 1x – Active Low POWER-ON • 1x – 1.
Product Technical Specification 1.7. Introduction ESD Refer to the following table for ESD Specifications. Table 3. ESD Specifications Category Connection Specification Operational RF ports IEC-61000-4-2 — Level (Electrostatic Discharge Immunity Test) Non-operational Host connector interface Unless otherwise specified: • JESD22-A114 ± 1kV Human Body Model • JESD22-A115 ± 200V Machine Model • SIM connector Signals Other host signals 1.8.
Product Technical Specification 1.8.2. Introduction Regulatory The AirPrime HL7548 and HL7588 are compliant with FCC and IC regulations. FCC and IC compliance will be reflected on the AirPrime HL7548 and HL7588 label. Table 5. Regulation Compliance Document Current Version Description GCF-CC v3.56.1 or later GCF Conformance Certification Criteria NAPRD.03 V5.
2. Pad Definition AirPrime HL7548 and HL7588 pads are divided into 3 functional categories. • Core functions and associated pads cover all the mandatory features for M2M connectivity and will be available by default across all CF 3 family of modules. These Core functions are always available and always at the same physical pad locations. A customer platform using only these functions and associated pads is guaranteed to be forward and/or backward compatible with the next generation of CF3 modules.
Product Technical Specification Pad Definition Pad # Signal Name Function I/O Active Low / High Power Supply Domain Recommendation for Unused Pads Type 9 UART1_DSR* / TRACE_DATA0 UART1 Data set ready / Trace data 0 O L 1.8V Connect to test point Core / Custom 10 GPIO2 / TRACE_DATA2 General purpose input/output / Trace data 2 I/O 1.8V Connect to test point Core / Custom 11 RESET_IN_N Input reset signal I 1.
Product Technical Specification Pad Definition Pad # Signal Name Function I/O Active Low / High Power Supply Domain Recommendation for Unused Pads Type 29 UIM1_RESET 1.8V/3V SIM1 Reset O L 1.8V/3V Mandatory connection Core 30 GND Ground 0V 0V Mandatory connection Extension 31 RF_DIV RF Input - Diversity Mandatory connection Extension 32 GND Ground 0V 0V Mandatory connection Extension 33 PCM_OUT* PCM data out O 1.
Product Technical Specification Pad Definition Recommendation for Unused Pads Type Mandatory connection Core 0V Mandatory connection Core I 1.8V Left Open Extension General purpose input/output I/O 1.8V Left Open Extension GPIO11 General purpose input/output I/O 1.8V Left Open Extension 54 GPIO15 General purpose input/output I/O 1.
Product Technical Specification Pad Definition Pad # Signal Name Function I/O 71 - 166 Note: 167 - 234 GND Ground GND 236 JTAG_RESET JTAG RESET I 237 JTAG_TCK JTAG Test Clock 238 JTAG_TDO 239 Active Low / High Power Supply Domain Recommendation for Unused Pads Type These pads are not available on the AirPrime HL7548 and HL7588 module. 0V 1.8V Left Open Extension I 1.8V Left Open Extension JTAG Test Data Output O 1.
Product Technical Specification 167 192 193 194 195 196 197 198 171 191 214 215 216 217 218 199 172 1 2 3 4 5 6 7 69 8 GND 9 32 10 GND PCM_OUT 11 28 12 UIM1_DATA UIM1_RESET GND RF_DIV 13 26 14 UIM1_VCC UIM1_CLK 15 22 16 26M_CLKOUT 32K_CLKOUT ADC1 NC 20 17 19 18 68 NC NC BAT_RTC 67 GND 66 GPIO5 GPIO4 UIM1_DET / GPIO3 65 21 64 VBATT VBATT_PA VBATT_PA TX_ON 63 23 62 24 25 190 213 228 229 230 219 200 173 189 212 227 234 231 220 201 174
3. Detailed Interface Specifications Note: If not specified, all electrical values are given for VBATT=3.7V and an operating temperature of 25°C. For standard applications, VBATT and VBATT_PA must be tied externally to the same power supply. For some specific applications, AirPrime HL7548 and HL7588 modules support separate VBATT and VBATT_PA connection if requirements below are fulfilled. 3.1.
Product Technical Specification Detailed Interface Specifications Parameter LTE in communication mode (TX Max) UMTS (TX Max) * Table 9.
Product Technical Specification Detailed Interface Specifications Parameter Minimum Typical Maximum Remarks Current capability Sleep Mode (mA) - - 3 Power management support up to 3mA output in Sleep mode Rise Time (ms) - - 1.5 Start-Up time from 0V 3.4. BAT_RTC The AirPrime HL7548 and HL7588 modules provide an input/output to connect a Real Time Clock power supply. This pad is used as a back-up power supply for the internal Real Time Clock.
Product Technical Specification Detailed Interface Specifications Pad # Signal Name Description 29 UIM1_RESET 1.8V/3V SIM1 Reset 64 UIM1_DET UIM1 Detection Table 13. Multiplex GPIO3 Electrical Characteristics of UIM1 Parameter Minimum Typical Maximum Remarks UIM1 Interface Voltage (V) (VCC, CLK, IO, RST) - 2.9 - - 1.80 - The appropriate output voltage is auto detected and selected by software. UIM1 Detect - 1.
Product Technical Specification 3.7. Detailed Interface Specifications Electrical Information for Digital I/O The AirPrime HL7548 and HL7588 support two groups of digital interfaces with varying current drain limits. The following list enumerates these interface groupings and the following table enumerates the electrical characteristics of each digital interface.
Product Technical Specification Detailed Interface Specifications Pad Number Signal Name 51 I/O Power Supply Domain GPIO14 I/O 1.8V 52 GPIO10 I/O 1.8V 53 GPIO11 I/O 1.8V 54 GPIO15 I/O 1.8V 64 GPIO3 I/O 1.8V 65 GPIO4 I/O 1.8V 66 GPIO5 I/O 1.8V 3.9. Multiplex UIM1_DET Main Serial Link (UART1) The main serial link (UART1) is used for communication between the AirPrime HL7548 and HL7588 modules and a PC or host processor.
Product Technical Specification Detailed Interface Specifications Pad # Signal Name* I/O* Description 8 UART1_DCD** O Signal data connection in progress 9 UART1_DSR** O Signal UART interface is ON * According to PC view. ** This signal is not available on the HL7548. 3.10. POWER-ON Signal (PWR_ON_N) A low-level signal should be provided to switch the AirPrime HL7548 and HL7588 module ON. It is internally connected to the permanent 1.
Product Technical Specification Table 19. Detailed Interface Specifications RESET_IN_N Electrical Characteristics Parameter Minimum Input Voltage-Low (V) Typical Maximum - 0.51 Input Voltage-High (V) 1.33 - 2.2 Reset assertion time (ms) 20 - - Power-up period (ms) from RESET_IN_N falling edge* 2000 - - * With the PWR_ON_N Signal at low level 3.12. Analog to Digital Converter (ADC1) One Analog to Digital Converter input, ADC1, is provided by the AirPrime HL7548 and HL7588 module.
Product Technical Specification Detailed Interface Specifications Pad Number Signal Name I/O I/O Type Description 23 32K_CLKOUT O 1.8V 32.768kHz Digital Clock output Enabling or disabling the clock out feature can be done using AT commands. For more information about AT commands, refer to documents [2] AirPrime HL7518 and HL7548 AT Commands Interface Guide and [3] AirPrime HL7588 AT Commands Interface Guide. 3.14. PCM Note: This interface is only available on the HL7588.
Product Technical Specification Table 24. Detailed Interface Specifications PCM Electrical Characteristics Signal Description Minimum Tsync_low + Tsync_high PCM-SYNC period 125 µs Tsync_low PCM-SYNC low time 62.5 µs Tsync_high PCM-SYNC high time 62.5 µs TCLK-cycle PCM-CLK period (T) 1.95 TIN-setup PCM-IN setup time 59.6 TIN-hold PCM-IN hold time 12 TOUT-delay PCM-OUT delay time TSYNC-delay PCM-SYNC output delay -24 Typical 2.6 Maximum 3.9 Unit µs ns ns 21.6 ns 31.
Product Technical Specification Detailed Interface Specifications Pad Number Signal Name Function Multiplex 10 TRACE_DATA2 Trace data 2 GPIO2 41 TRACE_CLK Trace clock GPIO8 Note: It is strongly recommended to provide access to this interface through Test Points. 3.15.2. JTAG The JTAG interface provides debug access to the core of the AirPrime HL7548 and HL7588. These JTAG signals are accessible through solder-able test points. Table 26.
Product Technical Specification Detailed Interface Specifications 3.16.2. RF Performances RF performances are compliant with 3GPP recommendation TS 36.101. Table 29.
4. Mechanical Drawings Figure 6. 4116369 Mechanical Drawing Rev 9.
Product Technical Specification Figure 7. 4116369 Mechanical Drawings Footprint Rev 9.
5. Design Guidelines 5.1. Power-Up Sequence Apply a low-level logic to the PWR_ON_N pad (pad 59); within approximately 25ms, VGPIO will appear to be at 1.8V. Either UART1 or the USB interface could be used to send AT commands. The AT command interface is available in about 7 seconds after PWR_ON_N for either UART1 or USB. When using UART1, the AT command interface is available after the transition of UART1_CTS from high to low level.
Product Technical Specification 5.2. Design Guidelines Module Switch-Off AT command AT+CPWROFF enables the user to properly switch the AirPrime HL7548 or HL7588 module off. AT+CPWROFF Module is ON PWR_ON_N Internal pull-up to 1V8 Module is OFF 2 secs VGPIO Figure 9. Power OFF Sequence for PWR_ON_N, VGPIO Note: PWR_ON_N is internally pulled up by 100kΩ to 1.8V. 5.3. Emergency Power OFF If required, the module can be switched off by controlling the RESET_IN_N pad (pad 11).
Product Technical Specification Design Guidelines AT+KSLEEP=1: • The module determines when it enters sleep mode (when no more tasks are running). • “0x00” character on the serial link wakes the module up. AT+KSLEEP=2: The module never enters sleep mode. 5.4.2. Using USB Use AT+KSLEEP=1 to allows the module to automatically enter sleep mode while the USB interface is in use. 5.5. Power Supply Design The AirPrime HL7548 and HL7588 modules should not be supplied with voltage over 4.
Product Technical Specification Design Guidelines Figure 11. EMC and ESD Components Close to the SIM 5.7. ESD Guidelines for USB When the USB interface is externally accessible, it is required to have ESD protection on the USB_VBUS, USB_D+ and USB_D- signals. Figure 12. ESD Protection for USB Note: It is not recommended to have an ESD diode with feedback path from USB_VBUS to either USB_D+ or USB_D-.
6. Reliability Specification The AirPrime HL7548 and HL7588 modules are tested against the Sierra Wireless Industrial Reliability Specification defined below. 6.1. Reliability Compliance The AirPrime HL7548 and HL7588 modules connected on a development kit board application are compliant with the following requirements. Table 32. Standards Conformity Abbreviation Definition IEC International Electro technical Commission ISO International Organization for Standardization 6.2.
Product Technical Specification 6.2.2. Reliability Specification Environmental Resistance Stress Tests The following tests the AirPrime HL7548 and HL7588 module resistance to extreme temperature. Table 34.
Product Technical Specification Reliability Specification Designation Condition Component Solder Wettability CSW Standard: JESD22 – B102, Method 1/Condition C, Solderability Test Method Special conditions: • Test method: Dip and Look Test with Steam preconditioning 8 h ±15min. dip for 5 +0/-0.
Product Technical Specification 6.2.5. Reliability Specification Mechanical Resistance Stress Tests The following tests the AirPrime HL7548 and HL7588 module resistance to vibrations and mechanical shocks. Table 37. Mechanical Resistance Stress Tests Designation Condition Standard: IEC 60068-2-6, Test Fc Sinusoidal Vibration Test SVT Special conditions: • Frequency range: 16 Hz to 1000 Hz • Displacement: 0.
Product Technical Specification 6.2.6. Reliability Specification Handling Resistance Stress Tests The following tests the AirPrime HL7548 and HL7588 module resistance to handling malfunctions and damage. Table 38.
7. Legal Information 7.1. FCC Regulations The HL7548 and HL7588 modules have been granted modular approval for mobile applications. Integrators may use the HL7548 or HL7588 modules in their final products without additional FCC certification if they meet the following conditions. Otherwise, additional FCC approvals must be obtained. 1. At least 20 cm separation distance between the antenna and the user’s body must be maintained at all times. 2.
Product Technical Specification Legal Information If a multi-layered PCB is used, the RF path on the board must not cross any signal (digital, analog or supply). If necessary, use StripLine structure and route the digital line(s) "outside" the RF structure. An example of proper routing is shown in the figure below. Stripline and Coplanar design requires having a correct ground plane at both sides. Consequently, it is necessary to add some vias along the RF path.
Product Technical Specification 7.2.1. Legal Information Radiation Exposure Statement This equipment complies with Canada radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. Cet équipement est conforme Canada limites d'exposition aux radiations dans un environnement non contrôlé.
8. Ordering Information Table 41. Ordering Information Model Name Description Part Number HL7548 HL7548 embedded module Contact Sierra Wireless for the latest SKU HL7588 HL7588 embedded module Contact Sierra Wireless for the latest SKU DEV-KIT HL Series Development Kit 6000620 4116369 Rev 9.
9.
Product Technical Specification Terms and Abbreviations Abbreviation Definition RF Radio Frequency RFI Radio Frequency Interference RMS Root Mean Square RST Reset RTC Real Time Clock RX Receive SCL Serial Clock SDA Serial Data SIM Subscriber Identification Module SMD Surface Mounted Device/Design SPI Serial Peripheral Interface SW Software PSRAM Pseudo Static RAM TBC To Be Confirmed TBD To Be Defined TP Test Point TX Transmit TYP Typical UART Universal Asynchronous R
