Product Technical Specification AirPrime HL7688 4119272 2.
Product Technical Specification Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost.
Product Technical Specification Patents This product may contain technology developed by or for Sierra Wireless Inc. This product includes technology licensed from QUALCOMM®. This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from InterDigital Group and MMP Portfolio Licensing. Copyright © 2016 Sierra Wireless. All rights reserved.
Product Technical Specification Document History Version Date Updates 1.0 May 23, 2016 Creation 1.1 May 26, 2016 Updated: Table 2 General Features 1.8.2 Regulatory 3.16.2 RF Performances 1.2 May 30, 2016 Updated: Figure 2 Mechanical Overview 4 Mechanical Drawings 2.0 August 16, 2016 Updated section 7 FCC Regulations 4119272 Rev 2.
Contents 1. INTRODUCTION .................................................................................................. 10 1.1. Common Flexible Form Factor (CF3)............................................................................. 10 1.2. Physical Dimensions ..................................................................................................... 10 1.3. General Features ..........................................................................................................
Product Technical Specification 3.16.2. 3.16.3. RF Performances ................................................................................................... 34 TX_ON Indicator (TX_ON) ..................................................................................... 34 4. MECHANICAL DRAWINGS................................................................................. 36 5. DESIGN GUIDELINES ......................................................................................... 39 5.1.
List of Figures Figure 1. Architecture Overview ................................................................................................... 13 Figure 2. Mechanical Overview .................................................................................................... 14 Figure 3. Pad Configuration ......................................................................................................... 22 Figure 4. PCM Timing Waveform .....................................................
List of Tables Table 1. Supported Bands/Connectivity ...................................................................................... 10 Table 2. General Features .......................................................................................................... 11 Table 3. ESD Specifications........................................................................................................ 15 Table 4. Environmental Specifications .....................................................
Product Technical Specification Table 38. Mechanical Resistance Stress Tests............................................................................. 47 Table 39. Handling Resistance Stress Tests ................................................................................ 48 Table 40. Ordering Information ..................................................................................................... 52 4119272 Rev 2.
1. Introduction This document is the Product Technical Specification for the AirPrime HL7688 Embedded Module. It defines the high level product features and illustrates the interfaces for these features. This document is intended to cover the hardware aspects of the product, including electrical and mechanical. The AirPrime HL7688 belongs to the AirPrime HL Series from Essential Connectivity Module family.
Product Technical Specification 1.3. Introduction General Features The table below summarizes the AirPrime HL7688 features. Table 2. General Features Feature Physical Electrical Description Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x 2.5mm (nominal) Complete body shielding RF connection pads (RF main interface) Baseband signals connection Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.
Product Technical Specification Feature Introduction Description Protocol Stack Single mode LTE operation: LTE FDD, bandwidth 1.4-20 MHz System Release: 3GPP Rel.
Product Technical Specification Feature Introduction Description Multiple (up to 20) cellular packet data profiles Sleep mode for minimum idle power draw Mobile-originated PDP context activation / deactivation Support QoS profile Connectivity Release 97 – Precedence Class, Reliability Class, Delay Class, Peak Throughput, Mean Throughput Release 99 QoS negotiation – Background, Interactive, and Streaming Static and Dynamic IP address.
Product Technical Specification 1.5. Introduction Interfaces The AirPrime HL7688 module provides the following interfaces and peripheral connectivity: 1x – 8-wire UART 1x – Active Low RESET 1x – USB 2.0 1x – Backup Battery Interface 2x – System Clock Out 1x – Active Low POWER-ON 1x – 1.
Product Technical Specification 1.7. Introduction ESD Refer to the following table for ESD Specifications. Note: Information specified in the following table is preliminary and subject to change. Table 3. ESD Specifications Category Connection Operational RF ports Specification IEC-61000-4-2 – Level (Electrostatic Discharge Immunity Test) Unless otherwise specified: Non-operational Host connector interface SIM connector Signals Other host signals 1.8.
Product Technical Specification 1.8.2. Introduction Regulatory The AirPrime HL7688 is compliant with FCC regulations. FCC compliance will be reflected on the AirPrime HL7688 label. Table 5. Regulation Compliance Document Current Version Description GCF-CC v3.56.1 or later GCF Conformance Certification Criteria NAPRD.03 V5.22 or later North American Program Reference Document FCC Part 22, 24, 27 NA Federal Communications Commission 1.8.3.
2. Pad Definition AirPrime HL7688 pads are divided into 3 functional categories. Core functions and associated pads cover all the mandatory features for M2M connectivity and will be available by default across all CF3 family of modules. These Core functions are always available and always at the same physical pad locations. A customer platform using only these functions and associated pads is guaranteed to be forward and/or backward compatible with the next generation of CF3 modules.
Product Technical Specification Pad Definition Pad # Signal Name Function I/O Active Low / High Power Supply Domain Recommendation for Unused Pads Type 9 UART1_DSR / TRACE_DATA0 UART1 Data set ready / Trace data 0 O L 1.8V Connect to test point Core / Custom 10 GPIO2 / TRACE_DATA2 General purpose input/output / Trace data 2 I/O 1.8V Connect to test point Core / Custom 11 RESET_IN_N Input reset signal I 1.
Product Technical Specification Pad Definition Pad # Signal Name Function I/O Active Low / High Power Supply Domain Recommendation for Unused Pads Type 29 UIM1_RESET 1.8V/3V SIM1 Reset O L 1.8V/3V Mandatory connection Core 30 GND Ground 0V 0V Mandatory connection Extension 31 RF_DIV RF Input - Diversity Mandatory connection Extension 32 GND Ground 0V 0V Mandatory connection Extension 33 PCM_OUT PCM data out O 1.8V Left Open Extension 34 PCM_IN PCM data in I 1.
Product Technical Specification Pad Definition Recommendation for Unused Pads Type Mandatory connection Core 0V Mandatory connection Core I 1.8V Left Open Extension General purpose input/output I/O 1.8V Left Open Extension GPIO11 General purpose input/output I/O 1.8V Left Open Extension 54 GPIO15 General purpose input/output I/O 1.
Product Technical Specification Pad # Signal Name 71 - 166 Note: Pad Definition Function I/O Active Low / High Power Supply Domain Recommendation for Unused Pads Type These pads are not available on the AirPrime HL7688 module. 167 - 234 GND Ground GND 236 JTAG_RESET JTAG RESET I 237 JTAG_TCK JTAG Test Clock 238 JTAG_TDO 239 240 0V Core 1.8V Left Open Extension I 1.8V Left Open Extension JTAG Test Data Output O 1.
Product Technical Specification 2.1. Figure 3. 4119272 Pad Definition Pad Configuration (Top View, Through Module) Pad Configuration Rev 2.
3. Detailed Interface Specifications Note: If not specified, all electrical values are given for VBATT=3.7V and an operating temperature of 25°C. For standard applications, VBATT and VBATT_PA must be tied externally to the same power supply. For some specific applications, AirPrime HL7688 modules support separate VBATT and VBATT_PA connection if requirements below are fulfilled. 3.1. Power Supply The AirPrime HL7688 modules is supplied through the VBATT signal with the following characteristics.
Product Technical Specification Detailed Interface Specifications Parameter LTE in communication mode (TX Max) UMTS (TX Max) Table 9. Minimum Typical Maximum Unit Band 2 630 650 895 mA Band 4 510 610 945 mA Band 5 440 520 745 mA Band 17 540 560 780 mA Band 2 570 660 770 mA Band 5 400 460 500 mA Typical Unit Current Consumption per Power Supply Parameter (at nominal voltage, 3.
Product Technical Specification 3.4. Detailed Interface Specifications BAT_RTC The AirPrime HL7688 module provides an input/output to connect a Real Time Clock power supply. This pad is used as a back-up power supply for the internal Real Time Clock. The RTC is supported when VBATT is available but a back-up power supply is needed to save date and hour when VBATT is switched off. If VBATT is available, the back-up battery can be charged by the internal 1.8V power supply regulator. Table 11.
Product Technical Specification Table 13. Detailed Interface Specifications Electrical Characteristics of UIM1 Parameter Minimum Typical Maximum Remarks UIM1 Interface Voltage (V) (VCC,CLK,IO,RST) - 2.9 - - 1.80 - The appropriate output voltage is auto detected and selected by software. UIM1 Detect - 1.
Product Technical Specification Table 15. Detailed Interface Specifications Digital I/O Electrical Characteristics Parameter Symbol Minimum Typical Maximum Input Current-High(µA) IIH - - 240 Input Current-Low(µA) IIL - - 240 DC Output Current-High (mA) IOH - - 6 DC Output Current-Low (mA) IOL -6 - - DC Output Current-High (mA) IOH - - 1 DC Output Current-Low (mA) Group 1 Group 2 Remarks IOL -1 - - Input Voltage-High(V) VIH 1.19 - 2.
Product Technical Specification 3.9. Detailed Interface Specifications Main Serial Link (UART1) The main serial link (UART1) is used for communication between the AirPrime HL7688 module and a PC or host processor. It consists of a flexible 8-wire serial interface that complies with RS-232 interface. The supported baud rates of the UART1 are 300, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 500000, 750000, 921600, 1843200, 3000000 and 3250000 bit/s.
Product Technical Specification Table 18. Detailed Interface Specifications PWR_ON_N Electrical Characteristics Parameter Minimum Input Voltage-Low (V) Typical Maximum - 0.51 Input Voltage-High (V) 1.33 - 2.2 Power-up period (ms) from PWR_ON_N falling edge 2000 - - PWR_ON_N assertion time (ms) 25 Note: As PWR_ON_N is internally pulled up with 47kΩ, an open collector or open drain transistor must be used for ignition.
Product Technical Specification Detailed Interface Specifications 3.12. Analog to Digital Converter (ADC1) One Analog to Digital Converter input, ADC1, is provided by the AirPrime HL7688 module. This converter is a 10-bit resolution ADC ranging from 0 to 1.2V. The following table describes the pad description of the ADC interface. Table 20.
Product Technical Specification Detailed Interface Specifications 3.14. PCM The Digital Audio (PCM) Interface allows connectivity with standard audio peripherals. It can be used, for example, to connect an external audio codec. The programmability of this interface allows addressing a large range of audio peripherals.
Product Technical Specification Detailed Interface Specifications Signal Description Minimum TSYNC-delay PCM-SYNC output delay -24 Typical Maximum Unit 31.2 ns The following figure shows the PCM timing waveform. Figure 4. PCM Timing Waveform 3.15. Debug Interfaces The AirPrime HL7688 module provides 2 interfaces for a powerful debug system. 3.15.1. Trace Debug The AirPrime HL7688 module provides a Trace Debug interface, providing real-time instruction and data trace of the modem core.
Product Technical Specification Detailed Interface Specifications 3.15.2. JTAG The JTAG interface provides debug access to the core of the AirPrime HL7688. These JTAG signals are accessible through solder-able test points. Table 26.
Product Technical Specification Detailed Interface Specifications 3.16.2. RF Performances Note: Table 29. Values in the tables below are preliminary and subject to change. Conducted RX Sensitivity – UMTS Bands Conducted Rx Sensitivity (dBm) Frequency Band Band 2 0.1% BER 12.2 kbps Band 5 Primary (Typical) Secondary (Typical) -109.5 -110.0 -110.0 -110.5 4G RF performances are compliant with 3GPP recommendation TS 36.101. Table 30.
Product Technical Specification Figure 5. 4119272 Detailed Interface Specifications TX_ON State During Transmission Rev 2.
4. Mechanical Drawings Figure 6. 4119272 Mechanical Drawing Rev 2.
Product Technical Specification Figure 7. 4119272 Mechanical Drawings Dimensions Drawing Rev 2.
Product Technical Specification Figure 8. 4119272 Mechanical Drawings Footprint Rev 2.
5. Design Guidelines 5.1. Power-Up Sequence Apply a LOW level logic to the PWR_ON_N pad (pad 59); within approximately 25ms, VGPIO will appear to be at 1.8V. Either UART1 or the USB interface could be used to send AT commands. The AT command interface is available in about 7 seconds after PWR_ON_N for either UART1 or USB. When using UART1, the AT command interface is available after the transition of UART1_CTS from high to low level.
Product Technical Specification 5.2. Design Guidelines Module Switch-Off AT command AT+CPWROFF enables the user to properly switch the AirPrime HL7688 module off. Figure 10. Power OFF Sequence for PWR_ON_N, VGPIO Note: PWR_ON_N is internally pulled up by 47kΩ to 1.8V. 5.3. Emergency Power OFF If required, the module can be switched off by controlling the RESET_IN_N pad (pad 11). This must only be used in emergency situations if the system freezes (not responding to AT commands).
Product Technical Specification Design Guidelines The module never enters sleep mode. 5.4.2. Using USB Use AT+KSLEEP=1 to allows the module to automatically enter sleep mode while the USB interface is in use. 5.5. Power Supply Design The AirPrime HL7688 module should not be supplied with voltage over 4.5V even temporarily or however briefly. If the system’s main board power supply unit is unstable or if the system’s main board is supplied with over 4.
Product Technical Specification Figure 12. 5.7. Design Guidelines EMC and ESD Components Close to the SIM ESD Guidelines for USB When the USB interface is externally accessible, it is required to have ESD protection on the USB_VBUS, USB_D+ and USB_D- signals. Figure 13. Note: ESD Protection for USB It is not recommended to have an ESD diode with feedback path from USB_VBUS to either USB_D+ or USB_D-.
6. Reliability Specification AirPrime HL7688 modules are tested against the Sierra Wireless Industrial Reliability Specification defined below. 6.1. Reliability Compliance The AirPrime HL7688 module connected on a development kit board application is compliant with the following requirements. Table 33. Standards Conformity Abbreviation Definition IEC International Electro technical Commission ISO International Organization for Standardization 6.2. Reliability Prediction Model 6.2.1.
Product Technical Specification 6.2.2. Reliability Specification Environmental Resistance Stress Tests The following tests the AirPrime HL7688 module’s resistance to extreme temperature. Table 35.
Product Technical Specification Reliability Specification Designation Condition Component Solder Wettability CSW Standard: JESD22 – B102, Method 1/Condition C, Solderability Test Method Special conditions: Test method: Dip and Look Test with Steam preconditioning 8 h+/-15min. dip for 5 +0/-0.
Product Technical Specification Designation Reliability Specification Condition Standard: IEC 60068-2-14, Test Nb Temperature Change TCH Special conditions: Temperature: -40°C to +90°C Temperature Variation: 3 +/- 0.6°C/min Number of cycles: 400 Dwell Time: 10 minutes Operating conditions: Un-powered Duration: 29 days 4119272 Rev 2.
Product Technical Specification 6.2.5. Reliability Specification Mechanical Resistance Stress Tests The following tests the AirPrime HL7688 module’s resistance to vibrations and mechanical shocks. Table 38. Mechanical Resistance Stress Tests Designation Condition Standard: IEC 60068-2-6, Test Fc Special conditions: Sinusoidal Vibration Test SVT Frequency range: 16 Hz to 1000 Hz Displacement: 0.
Product Technical Specification Reliability Specification Designation Condition MST Special conditions: Shock Test 1: Wave form: Half sine Peak acceleration: 30g Duration: 11ms Number of shocks: 8 Direction: ±X, ±Y, ±Z Shock Test 2: Wave form: Half sine Peak acceleration: 100g Duration: 6ms Number of shocks: 3 Direction: ±X, ±Y, ±Z Operating conditions: Un-powered Duration: 72 hours 6.2.6.
Product Technical Specification Designation Reliability Specification Condition Operating conditions: Un-powered Duration: 6 hours 4119272 Rev 2.
7. FCC Regulations The AirPrime HL7688 module has been granted modular approval for mobile applications. Integrators may use the HL7688 module in their final products without additional FCC certification if they meet the following conditions. Otherwise, additional FCC approvals must be obtained. 1. At least 20 cm separation distance between the antenna and the user’s body must be maintained at all times. 2.
Product Technical Specification FCC Regulations If a multi-layered PCB is used, the RF path on the board must not cross any signal (digital, analog or supply). If necessary, use StripLine structure and route the digital line(s) "outside" the RF structure. An example of proper routing is shown in the figure below. Stripline and Coplanar design requires having a correct ground plane at both sides. Consequently, it is necessary to add some vias along the RF path.
8. Ordering Information Table 40. Ordering Information Model Name Description Part Number HL7688 HL7688 embedded module Contact Sierra Wireless for the latest SKU DEV-KIT HL Series Development Kit 6000620 4119272 Rev 2.
9.
Product Technical Specification Terms and Abbreviations Abbreviation Definition RF Radio Frequency RFI Radio Frequency Interference RMS Root Mean Square RST Reset RTC Real Time Clock RX Receive SCL Serial Clock SDA Serial Data SIM Subscriber Identification Module SMD Surface Mounted Device/Design SPI Serial Peripheral Interface SW Software PSRAM Pseudo Static RAM TBC To Be Confirmed TBD To Be Defined TP Test Point TX Transmit TYP Typical UART Universal Asynchronous R
