AirPrime MC7475 Product Technical Specification 41110251 Rev 3 Proprietary and Confidential Contents subject to change
Product Technical Specification Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost.
Preface Copyright ©2017 Sierra Wireless. All rights reserved. Trademarks Sierra Wireless®, AirPrime®, AirLink®, AirVantage® and the Sierra Wireless logo are registered trademarks of Sierra Wireless, Inc. Windows® and Windows Vista® are registered trademarks of Microsoft Corporation. Other trademarks are the property of their respective owners. Contact Information Sales information and technical support, including warranty and returns Web: sierrawireless.
Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Supported RF Bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Physical Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Application Interface Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents Interference and Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Interference From Other Wireless Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Host-generated RF Interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Device-generated RF Interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Methods to Mitigate Decreased Rx Performance . . . .
Product Technical Specification Recommended GPS Antenna Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Antenna Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Design Checklist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
List of Tables Table 1-1: Supported RF Bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 1-2: Required Host-Module Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 2-1: Standards Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 3-1: Connector Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
List of Figures Figure 3-1: System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 3-2: SIM Application Interface (applies to both SIM interfaces) . . . . . . . . . . . . . . . 20 Figure 3-3: SIM Card Contacts (Contact View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 3-4: Recommended WAKE_N Connection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 3-5: Example LED. . . . . . . . . . . . . . .
1 1: Introduction The Sierra Wireless MC7475 PCI Express Mini Card is a compact, lightweight, wireless modem that provides LTE and GPS connectivity for M2M applications, notebook, ultrabook and tablet computers over several radio frequency bands. Supported RF Bands The modem, based on the Altair FourGee6300 baseband processor, supports data operation on LTE networks over the bands described in Table 1-1.
Product Technical Specification Modem Features • • • • • • • • Traditional modem COM port support for AT commands USB suspend / resume Sleep mode for minimum idle power draw Enhanced Operator Name String (EONS) Mobile-originated PDP context activation / deactivation Static and Dynamic IP address. The network may assign a fixed IP address or dynamically assign one using DHCP (Dynamic Host Configuration Protocol). PAP and CHAP support PDP context type (IPv4, IPv6, or IPv4v6).
Introduction Required Connectors Table 1-2 describes the connectors used to integrate AirPrime MC-series modules into your host device. Table 1-2: Required Host-Module Connectors a Connector type Description • RF cables • Mate with Hirose U.FL connectors (model U.FL #CL331-0471-0-10) Three connector jacks EDGE (52-pin) • • • Industry-standard mating connector Some manufacturers include Tyco, Foxconn, Molex Example: UDK board uses Molex 67910-0001 SIM • Industry-standard connector.
2 2: Standards Compliance The MC7475 Mini Card complies with the mandatory requirements described in the following standards. The exact set of requirements supported is network operatordependent. Table 2-1: Standards Compliance Technology LTE Rev 3 Sep.
3 3: Electrical Specifications The system block diagram in Figure 3-1 on page 13 represents the MC7475 module integrated into a host system. The module includes the following interfaces to the host: • Power —Supplied to the module by the host. • WAKE_N— Signal used to wake the host when specific events occur. • WAN_LED_N —Active-low LED drive signal provides an indication of RADIO ON state, either WAN or GPS. • SYSTEM_RESET_N —Active-low reset input. • Antenna —Three U.
Product Technical Specification Host Interface Pin Assignments The MC7475 host I/O connector provides pins for power, serial communications, and control. Pin assignments are listed in Table 3-1. Refer to the following tables for pin details based on interface types: • Table 3-2, Power and Ground Specifications, on page 18 • Table 3-3, USB Interfaces, on page 18 • Table 3-4, SIM Interface Signals, on page 19 • Table 3-5, Module Control Signals, on page 22 Note: On any given interface (USB, SIM, etc.
Electrical Specifications Table 3-1: Connector Pin Assignments a (Continued) Voltage levels (V) Pin Pin 7 Signal name USIM2_RST type b - Description SIM 2 Reset Active state Direction c Output Min Typ Low 0 - 0.45 High 2.55 (3V SIM) - 3.10 (3V SIM) 1.35 (1.8V SIM) 8 USIM_PWR - SIM VCC supply Output Max Power 1.90 (1.8V SIM) 2.90 (3V SIM) 3.00 (3V SIM) 3.10 (3V SIM) 1.75 (1.8V SIM) 1.80 (1.8V SIM) 1.85 (1.
Product Technical Specification Table 3-1: Connector Pin Assignments a (Continued) Voltage levels (V) Pin Pin 19 Signal name USIM2_DATA type b - Description SIM 2 IO pin Active state Direction c Input Low Min -0.30 (3V SIM) Typ - -0.30 (1.8V SIM) High Output Max 0.60 (3V SIM) 0.35 (1.8V SIM) 2.10 (3V SIM) 3.00 (3V SIM) 3.30 (3V SIM) 1.17 (1.8V SIM) 1.80 (1.8V SIM) 2.10 (1.8V SIM) Low 0 - 0.40 High 2.55 (3V SIM) 3.00 (3V SIM) 3.10 (3V SIM) 1.35 (1.8V SIM) 1.80 (1.8V SIM) 1.
Electrical Specifications Table 3-1: Connector Pin Assignments a (Continued) Voltage levels (V) Pin Pin Signal name type b Description Active state Direction c Min Typ Max 42 WAN_LED_N OC LED Driver Output Low 0 - 0.15f 43 GND V Ground Input Power - 0 - 44 ANT_CTRL2 / GPIO3 - (ANT_CTRL2) Customerdefined external switch control for multiple antennas Output High 1.35 1.80 1.90 Output Low 0 - 0.8 (GPIO3) General purpose I/O Input High 1.53 1.80 2.
Product Technical Specification e. The module must not be plugged into a port that supports PCI Express—the pin is used by a PCIE signal, which can cause the module to be in reset state or occasionally reset. f. Max voltage level when current < 100 mA. Power Supply The host provides power to the MC7475 through multiple power and ground pins as summarized in Table 3-2.
Electrical Specifications basis and needs to be characterized by the OEM. Note that throughput will be reduced and may vary significantly based on packet size, host interface, and firmware revision. SIM Interface The module supports up to two SIMs (Subscriber Identity Module) (1.8 V or 3 V). Each SIM holds information for a unique account, allowing users to optimize their use of each account on multiple devices. Note: Host support for SIM interface signals is required.
Product Technical Specification USIM_PWR 4.7uF X5R typ 0.1uF (Optional. Locate near the SIM socket) 15 k - 30 k NOTE: UIM signals refer to both USIM1 and USIM2. Located near SIM socket (Optional. Locate near the SIM socket) 47 pF, 51 USIM_CLK (C1) (C3) USIM_DATA (C7) USIM_RST (C2) USIM_GND (C5) SIM card connector AirPrime embedded module Located near SIM socket.
Electrical Specifications SIM Implementation Note: For interface design requirements, refer to ETSI TS 102 230 V5.5.0, section 5.2. Rev 3 Sep.17 When designing the remote SIM interface, you must make sure that SIM signal integrity is not compromised.
Product Technical Specification Control Interface (Signals) The MC7475 provides signals for: • Waking the host when specific events occur • LED driver output These signals are summarized in Table 3-5 and paragraphs that follow. Table 3-5: Module Control Signals Name Pin Description Type a WAKE_N 1 Wake host OC WAN_LED_N 42 LED driver OC a. OC—Open Collector; PU—Digital pin Input, internal pull up WAKE_N — Wake Host Note: Host support for WAKE_N is optional.
Electrical Specifications VCC Current limiting Resistor LED WAN_LED_N MiniCard MIO Figure 3-5: Example LED SYSTEM_RESET_N—Reset Input Note: Host support for SYSTEM_RESET_N is optional. SYSTEM_RESET_N has an internal 1.8 V internal pull up that requires an open collector input from the host. Set this signal to active low to reset the device. Note that the minimum pulse width is 2 s.
4 4: RF Specifications The MC7475 includes three RF connectors for use with host-supplied antennas: • Main RF connector—Tx/Rx path • GPS RF connector—Dedicated GPS • Auxiliary RF connector—Rx diversity The module does not have integrated antennas. Main RF connector GPS RF connector Auxiliary (Rx diversity) RF connector I/O connector Figure 4-1: Module Connectors RF Connections When attaching antennas to the module: • Use Hirose U.FL connectors (3 mm x 3 mm, low profile; model U.
RF Specifications Antenna and Cabling When selecting the antenna and cable, it is critical to RF performance to optimize antenna gain and cable loss. Note: For detailed electrical performance criteria, see Appendix 8: Antenna Specification on page 43. Choosing the Correct Antenna and Cabling When matching antennas and cabling: • The antenna (and associated circuitry) should have a nominal impedance of 50 with a recommended return loss of better than 10 dB across each frequency band of operation.
Product Technical Specification the module from the host board. This is mainly an issue for host designs that have signals traveling along the length of the module, or circuitry operating at both ends of the module interconnects. Interference and Sensitivity Several interference sources can affect the module’s RF performance (RF desense). Common sources include power supply noise and devicegenerated RF.
RF Specifications Methods to Mitigate Decreased Rx Performance It is important to investigate sources of localized interference early in the design cycle. To reduce the effect of device-generated RF on Rx performance: • Put the antenna as far as possible from sources of interference. The drawback is that the module may be less convenient to use. • Shield the host device. The module itself is well shielded to avoid external interference. However, the antenna cannot be shielded for obvious reasons.
Product Technical Specification Note: Sierra Wireless has the capability to measure TIS (Total Isotropic Sensitivity) and TRP (Total Radiated Power) according to CTIA's published test procedure. Sensitivity vs. Frequency For LTE bands, sensitivity is defined as the RF level at which throughput is 95% of maximum.
RF Specifications GPS Specifications Note: For detailed electrical performance criteria, see Recommended GPS Antenna Specifications on page 45. Table 4-4: GPS Specifications Parameter/feature Description Satellite channels Maximum 12 channels, simultaneous tracking Protocols NMEA 0183 V3.0 Acquisition time Hot start: 5 s Cold start: 37 s Note: Measured with signal strength = -135 dBm.
5 5: Power Power Consumption Power consumption measurements in the tables below are for the MC7475 Mini Card module connected to the host PC via USB. The module does not have its own power source and depends on the host device for power. For a description of input voltage requirements, see Power Supply on page 18. Table 5-1: Averaged Standby DC Power Consumption Current Bands a Description VCC Standby current consumption (Sleep mode deactivatedc) LTE Typ Max b Signal Unit Band 2 13.
Power Table 5-2: Averaged Call Mode DC Power Consumption Current a Description Tx power Band Typ Unit Notes LTE 23 dBm B2/B4 900 mA 100/50 Mbps, 20 MHz BW B12 828 mA 60/25 Mbps, 10 MHz BW B125 647 mA 7.2/12.6 Mbps, 3 MHz BW 1012 mA All LTE bands Peak current (averaged over 100 s) a. Measured at 25ºC/nominal 3.3 V voltage Table 5-3: Miscellaneous DC Power Consumption Current / Voltage Signal VCC Description Maximum current Min Typ Max Unit Notes / configuration — — 1.
Product Technical Specification DEVICE STATE Disconnected Off Power-on Sequence Power-off Sequence Active Off Disconnected High VCC Low t_USB_suspend t_pwr_on_seq USB_D+ (Double enumeration) High Low t_pwr_off_seq t_USB_active t_pwr_on_seq USB_D+ (Single enumeration) High Low t_pwr_off_seq Figure 5-1: Signal Timing (USB Enumeration) Table 5-4: USB 2.
Power Power Supply Noise Noise in the power supply can lead to noise in the RF signal. The power supply ripple limit for the module is no more than 100 mVp-p 1 Hz to 100 kHz. This limit includes voltage ripple due to transmitter burst activity. Additional decoupling capacitors can be added to the main VCC line to filter noise into the device. Rev 3 Sep.
6: Mechanical and Environmental Specifications The MC7475 module complies with the mechanical and environmental specifications in Table 6-1. Final product conformance to these specifications depends on the OEM device implementation.
Mechanical and Environmental Specifications Device Views Figure 6-1: Top View 1±0.1 29.85±0.15 2.6±0.1 24.2±0.1 +0.15 1.6 -0.05 4.88±0.25 19.29±0.25 48.05±0.1 50.8±0.15 14.5±0.25 8.25±0.1 3.85±0.1 4±0.1 1.65±0.1 4±0.05 13.6±0.05 5.6±0.05 PIN #51 +0.15 2.6 -0.10 1.5±0.1 TOP SIDE 2.55±0.1 TYP PIN #1 0.25±0.1 MAX 0.6±0.05 TYP 0.8±0.03 pitch TYP (Note: All dimensions shown in mm.) Figure 6-2: Dimensioned View Rev 3 Sep.
Product Technical Specification Labeling MC7430 IMEI # 352678011234569 FPPDDDYNNNNHH BB ||||||||||||||||||||||||||||||||||| FCC ID: N7Nxxxxxx PRODUCT OF CHINA Figure 6-3: Sample Unit Label Note: The displayed label is an example only. The production label will vary by SKU.
Mechanical and Environmental Specifications Thermal Considerations Embedded modules can generate significant amounts of heat that must be dissipated in the host device for safety and performance reasons. RF Baseband Figure 6-4: Shield locations (Top view) The amount of thermal dissipation required depends on: • Supply voltage—Maximum power dissipation for the module can be up to 3.5 W at voltage supply limits.
Product Technical Specification 29.5±0.2 Copper Pad Figure 6-5: Copper Pad Location on Bottom Side of Module • • • • Maximize airflow over/around the module. Locate the module away from other hot components. Module mounting holes must be used to attach (ground) the device to the main PCB ground or a metal chassis. You may also need active cooling to pull heat away from the module. Note: Adequate dissipation of heat is necessary to ensure that the module functions properly.
Mechanical and Environmental Specifications (For acceptance, certification, quality, and production (including RF) test suggestions, see Testing on page 15.) Rev 3 Sep.
7: Regulatory Compliance and Industry Certifications This module is designed to meet, and upon commercial release, will meet the requirements of the following regulatory bodies and regulations, where applicable: • Federal Communications Commission (FCC) of the United States Upon commercial release, the following industry certifications will have been obtained, where applicable: • PTCRB Additional certifications and details on specific country approvals may be obtained upon customer request—contact your Sier
Regulatory Compliance and Industry Certifications network. Use of a cellular phone in an aircraft is illegal in some jurisdictions. Failure to observe this instruction may lead to suspension or denial of cellular telephone services to the offender, or legal action or both. Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. The MC7475 module may be used normally at this time.
Product Technical Specification · The output power and antenna gain in a collocated configuration must not exceed the limits and configurations stipulated in Table 7-2. Table 7-2: Collocated Radio Transmitter Specifications Device Technology Frequency (MHz) EIRP Limit (dBm) Collocated transmittersa WLAN 2400–2500 23 5150–5850 23 2300–2400 25 2500–2700 25 3300–3800 25 2400–2500 15 WiMAX BT a. Valid collocated transmitter combinations: WLAN+BT; WiMAX+BT. (WLAN+WiMAX+BT is not permitted.
8 8: Antenna Specification This appendix describes recommended electrical performance criteria for main path, Rx diversity path, and GPS antennas used with AirPrime embedded modules. The performance specifications described in this section are valid while antennas are mounted in the host device with antenna feed cables routed in their final application configuration. Note: Antennas should be designed before the industrial design is finished to make sure that the best antennas can be developed.
Product Technical Specification Table 8-1: Antenna Requirements (Continued) a Parameter Total radiated efficiency of Ant1 and Ant2 Requirements > 50% on all bands Comments • • • Measured at the RF connector. Includes mismatch losses, losses in the matching circuit, and antenna losses, excluding cable loss. Sierra Wireless recommends using antenna efficiency as the primary parameter for evaluating the antenna system.
Antenna Specification a. These worst-case VSWR figures for the transmitter bands may not guarantee RSE levels to be within regulatory limits. The device alone meets all regulatory emissions limits when tested into a cabled (conducted) 50 ohm system. With antenna designs with up to 2.5:1 VSWR or worse, the radiated emissions could exceed limits. The antenna system may need to be tuned in order to meet the RSE limits as the complex match between the module and antenna can cause unwanted levels of emissions.
Product Technical Specification • • • All tests (except isolation/correlation coefficient)—Test the main or Rx diversity antenna with the other antenna terminated. Any metallic part of the antenna system that is exposed to the outside environment needs to meet the electrostatic discharge tests per IEC61000-42 (conducted discharge +8kV). The functional requirements of the antenna system are tested and verified while the embedded module’s antenna is integrated in the host device.
9 9: Design Checklist This chapter provides a summary of the design considerations mentioned throughout this guide. This includes items relating to the power interface, RF integration, thermal considerations, cabling issues, and so on. Note: This is NOT an exhaustive list of design considerations. It is expected that you will employ good design practices and engineering principles in your integration.
Product Technical Specification Table 9-1: Hardware Integration Design Considerations (Continued) Suggestion Section where discussed Keep very low capacitance traces on the USIM_DATA and USIM_CLK signals. SIM Implementation on page 21 To minimize noise leakage, establish a very good ground connection between the module and host. Ground Connection on page 25 Route cables away from noise sources (for example, power supplies, LCD assemblies, etc.).
10 10: Packaging Sierra Wireless AirPrime Mini Cards are packaged in sealed manufacturing boxes, each containing a single tray with a capacity of 100 modules (Figure 10-1 and Figure 10-2). Groups of three manufacturing boxes are then inserted into an outer box for shipping (Figure 10-3). In the standard packaging: 1. Mini Cards are inserted, system connector first, into the base portion (T1) of a two-part tray. all facing the same direction.
Product Technical Specification T2 EP1 T1 B1 P1 L4 L3 B1 Figure 10-2: Shipping Package 5. Three manufacturing boxes are placed in an outer shipping box (B2). If fewer than three manufacturing boxes are being shipped, empty boxes are added to the outer box 6. The outer box is sealed with security tape (P1) and a label (L5) is placed on the box. B1 P1 B2 B2 L5 Figure 10-3: Outer (shipping) Box Rev 3 Sep.
11 11: References This guide deals specifically with hardware integration issues that are unique to AirPrime embedded modules. Sierra Wireless Documents For additional documents describing embedded module design, usage, and integration issues, contact your Sierra Wireless account representative. Command Documents [1] AT Command Set for User Equipment (UE) (Release 6) (3GPP TS 27.
A A: Acronyms Table A-1: Acronyms and Definitions Acronym or term Definition 3GPP 3rd Generation Partnership Project 8PSK Octagonal Phase Shift Keying AGC Automatic Gain Control API Application Programming Interface BER Bit Error Rate—A measure of receive sensitivity BLER Block Error Rate bluetooth Wireless protocol for data exchange over short distances CQI Channel Quality Indication COM Communication port CS Circuit-switched CSG Closed Subscriber Group CW Continuous waveform dB
Acronyms Table A-1: Acronyms and Definitions (Continued) Acronym or term Rev 3 Sep.17 Definition ERP Effective Radiated Power ESD Electrostatic Discharge FCC Federal Communications Commission The U.S. federal agency that is responsible for interstate and foreign communications. The FCC regulates commercial and private radio spectrum management, sets rates for communications services, determines standards for equipment, and controls broadcast licensing. Consult www.fcc.gov.
Product Technical Specification Table A-1: Acronyms and Definitions (Continued) Acronym or term Rev 3 Sep.17 Definition IS Interim Standard. After receiving industry consensus, the TIA forwards the standard to ANSI for approval. ISIM IMS Subscriber Identity Module (Also referred to as a SIM card) LED Light Emitting Diode. A semiconductor diode that emits visible or infrared light.
Acronyms Table A-1: Acronyms and Definitions (Continued) Acronym or term Rev 3 Sep.17 Definition PSS Primary synchronisation signal PST Product Support Tools PTCRB PCS Type Certification Review Board QAM Quadrature Amplitude Modulation. This form of modulation uses amplitude, frequency, and phase to transfer data on the carrier wave.
Product Technical Specification Table A-1: Acronyms and Definitions (Continued) Acronym or term Rev 3 Sep.17 Definition SSS Secondary synchronisation signal. SUPL Secure User Plane Location TDD Time Division Duplexing TIA/EIA Telecommunications Industry Association / Electronics Industry Association.
Index Numerics 3D gain, average gain 3D average (GNSS), 45 3GPP compliance LTE, 12 connection grounding, 25 connectors, 24 connectors, required host-module, 11 control interface, 22 CQI, 10 A D acronyms and definitions, 52– 56 antenna connection considerations, 24 connectors, 13 custom, design, 25 GNSS, specifications, recommended, 45 limit, matching coaxial connections, 24 location, considerations, 25 matching, considerations, 25 maximum cable loss, 24 routing, 25 specification, 43– 46 specifications,
Product Technical Specification G mean effective gain imbalance, 44 mechanical specifications, 34– 36 gain GNSS, 45 maximum, 41, 44 mean effective, 44 mean effective imbalance, 44 GNSS antenna specifications, recommended, 45 connector location, 24 features supported, 10 GPS specifications, 29 ground specifications, 18 grounding connection considerations, 25 N noise leakage, minimizing, 25 RF interference, power supply, 33 O OEM labeling, 36 ordering information, 11 P H packaging, 49 paging procedure
Index T RF antenna cable loss, maximum, 24 antenna connection, considerations, 24 connectors, required, 11 desense device-generated, 26 harmonic energy, filtering, 27 mitigation suggestions, 27 shielding suggestions, 27 interference other devices, 26 power supply, 33 wireless devices, 26 RF bands supported summary, 9 LTE, 28 RF connector location, 24 RF specifications, 24–?? RI, 10 RSE, 27 Rx sensitivity conducted, 28 temperature specifications, 34 temperature, module.
