Product Specs

Drawing No.：JW205100XX
Date：May 30, 2019
(3/58)
CONFIDENTIAL
© silex technology, Inc.
目次 (Index)
1. 製品概要 (Product introduction) ........................................................................................................... 4
2. ハードウェアブロック図 (Hardware block diagram) ................................................................................. 6
3. 基板仕様 (Board specifications) ........................................................................................................... 7
3.1. 一般仕様 (General specifications) .....................................................................................................7
3.2. 環境条件 (Environmental conditions) ................................................................................................8
3.3. 電気的仕様 (Electrical specifications) .................................................................................................9
3.4. 消費電流仕様 (Current consumption specifications) ........................................................................... 11
3.5. 無線 LAN 一般仕様 (Wireless LAN general specifications) .................................................................... 13
3.6. 無線 LAN 送信仕様 (Wireless LAN transmitter specifications) ............................................................... 15
3.7. 無線 LAN 受信仕様 (Wireless LAN Receiver specifications)................................................................... 18
3.8. Bluetooth 一般仕様 (Bluetooth general specifications) ....................................................................... 20
3.9. Bluetooth 送信仕様 (Bluetooth Transmitter specifications) .................................................................. 21
3.10. Bluetooth 受信仕様 (Bluetooth Receiver specifications) ...................................................................... 21
4. 信号仕様 (Signal pin specifications) .................................................................................................... 22
4.1. ピン配置 (Pin locations) ................................................................................................................ 22
4.2. 信号仕様 (Signal specifications) ..................................................................................................... 23
4.3. 信号定義 (Signal definitions) .......................................................................................................... 28
5. インターフェイス/タイミング仕様 (Interface / timing specifications) ........................................................ 29
5.1. WLAN SDIO AC タイミング仕様 (WLAN SDIO AC timing specifications) ................................................ 29
5.2. Bluetooth UART 仕様 (Bluetooth UART interface specifications) .......................................................... 33
5.3. Bluetooth 音声インターフェイス仕様(Bluetooth audio interface specifications) ........................................ 34
5.4. パワーON/OFF, リセットタイミング (Power on/off and reset timing) ..................................................... 35
6. 適合規格 (Standards Compliance) ...................................................................................................... 36
6.1. 規格一覧 (Standard list) ................................................................................................................ 36
6.2. 推奨アンテナリスト(Recommended Antenna List) .............................................................................. 37
6.3. Federal Communications Commission (FCC) Statement .................................................................... 38
6.4. Canada, Industry Canada (IC) ...................................................................................................... 40
7. 機械的仕様 (Mechanical Specifications) ............................................................................................... 42
8. 表示仕様 (Indication specifications) .................................................................................................... 43
9. 構成リスト (Components composition List) ......................................................................................... 44
10. 梱包仕様 (Packing specifications) ....................................................................................................... 45
11. 信頼性試験 (Reliability test) ............................................................................................................... 48
12. 使用上の注意 (Notifications) .............................................................................................................. 51
13. 付録 A 参考ランド設計 (Appendix-A Reference land design) ............................................................... 53
14. 付録 B SMT リフロー条件 (Appendix -B SMT reflow profiles) .............................................................. 54
15. 付録 C 仕向け毎の送信電力 (Appendix -C TX power at each destination) .............................................. 55
15.1. Japan ......................................................................................................................................... 55
15.2. EU ............................................................................................................................................. 56
15.3. US ............................................................................................................................................. 57