User's Manual

Bluegiga Technologies Oy
Page 45 of 52
18 Soldering Recommendations
BT111 is compatible with a industrial standard reflow profile for Pb-free solders. The reflow profile used is
dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and
particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations.
Bluegiga Technologies will give following recommendations for soldering the module to ensure the reliable
solder joint and operation of the module after soldering. Since the profile used is process and layout
dependent, the optimal profile should be studied case by case. Thus the following recommendation should be
taken into account as a starting point.
 Refer to technical documentations of particular solder paste for profile configurations
 Avoid using more than one flow.
 Reliability of the solder joint and self-alignment of the component are dependent on the solder
volume. Minimum of 150m stencil thickness is recommended.
 Aperture size of the stencil should be 1:1 with the pad size.
 A low residue, “no clean” solder paste should be used due to low mounted height of the
component.