User's Manual

9. Soldering Recommendations
This section describes the soldering recommendations regarding WGM110 Module.
WGM110 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal
mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used. Consult the datasheet
of particular solder paste for profile configurations.
• Use the following recommendations for soldering the module to ensure reliable solder joint and operation of the module after solder-
ing. Since the profile used is process and layout dependent, the optimum profile should be studied case by case. Thus, the following
recommendations should be taken as a starting point guide.
• Refer to technical documentations of particular solder paste for profile configurations.
• Avoid using more than one flow.
• Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of 150 μm stencil
thickness is recommended.
• Aperture size of the stencil should be 1:1 with the pad size.
• A low residue, “no clean” solder paste should be used due to low mounted height of the component.
• If the vias used on the application board have a diameter larger than 0.3 mm, it is recommended to mask them at the module side to
prevent solder wicking through the via holes. Solders have a tendency to fill holes and leave voids in the thermal pad solder junction,
as well as form solder balls on the other side of the application board which can in some cases be problematic.
WGM110 Wizard Gecko Wi-Fi
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Module Data Sheet
Soldering Recommendations
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