Specifications

Si2457/Si2434/Si2415
Rev. 0.91 69
Package Outline: 24-Pin TSSOP
Figure 7 illustrates the package details for the Si2457/34/15. Table 18 lists the values for the dimensions shown in
the illustration.
Figure 7. 24-Pin Thin Shrink Small Outline Package (TSSOP)
Table 18. Package Diagram Dimensions
Symbol
Millimeters
Min Max
A — 1.20
A1 0.05 0.15
B 0.19 0.30
C 0.09 0.20
D 7.70 7.90
E 4.30 4.50
e 0.65 BSC
H 6.40 BSC
L 0.45 0.75
θ 0° 8°
γ 0.10
bbb 0.10
ddd 0.20
γ
E
B
D
L
θ
C
A
A1
ABddd C
H
A
e
B
C
ABCbbb
(2x)
Approximate device weight is 115.7 mg.