Data Sheet
Table Of Contents
- 1. Feature List
- 2. Ordering Information
- 3. System Overview
- 4. Electrical Characteristics
- 4.1 Absolute Maximum Ratings
- 4.2 General Operating Conditions
- 4.3 MCU Current Consumption with 3 V Supply
- 4.4 Radio Current Consumption with 3 V Supply
- 4.5 RF Transmitter General Characteristics for the 2.4 GHz Band
- 4.6 RF Receiver General Characteristics for the 2.4 GHz Band
- 4.7 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate
- 4.8 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate
- 4.9 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate
- 4.10 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate
- 4.11 High-Frequency Crystal
- 4.12 Low Frequency Crystal Oscillator
- 4.13 Precision Low Frequency RC Oscillator (LFRCO)
- 4.14 GPIO Pins
- 4.15 Microcontroller Peripherals
- 4.16 Typical Performance Curves
- 5. Reference Diagrams
- 6. Pin Definitions
- 7. Design Guidelines
- 8. Package Specifications
- 9. Soldering Recommendations
- 10. Tape and Reel
- 11. Certifications
- 12. Revision History
8.2 Recommended PCB Land Pattern
The recommended PCB Land Pattern is shown in Figure 8.3 Module Land Pattern on page 41
Figure 8.3. Module Land Pattern
Table 8.2. PCB Land Pattern Dimensions
Dimension Typ (mm)
D1 4.50
D2 2.65
E1 4.50
E2 2.25
eD1 0.45
eD2 0.90
b 0.25
e 0.50
L 0.35
L1 0.50
Note:
1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
4. The stencil thickness should be 0.100 mm (4 mils).
5. The stencil aperture to land pad size recommendation is 80% paste coverage.
6. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use
different parameters and fine tune their SMT process as required for their application and tooling.
BGM220S Wireless Gecko Bluetooth Module Data Sheet
Package Specifications
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