Data Sheet
Table Of Contents
- 1. Feature List
- 2. Ordering Information
- 3. System Overview
- 4. Electrical Characteristics
- 4.1 Absolute Maximum Ratings
- 4.2 General Operating Conditions
- 4.3 MCU Current Consumption with 3 V Supply
- 4.4 Radio Current Consumption with 3 V Supply
- 4.5 RF Transmitter General Characteristics for the 2.4 GHz Band
- 4.6 RF Receiver General Characteristics for the 2.4 GHz Band
- 4.7 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate
- 4.8 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate
- 4.9 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate
- 4.10 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate
- 4.11 High-Frequency Crystal
- 4.12 Low Frequency Crystal Oscillator
- 4.13 Precision Low Frequency RC Oscillator (LFRCO)
- 4.14 GPIO Pins
- 4.15 Microcontroller Peripherals
- 4.16 Typical Performance Curves
- 5. Reference Diagrams
- 6. Pin Definitions
- 7. Design Guidelines
- 8. Package Specifications
- 9. Soldering Recommendations
- 10. Tape and Reel
- 11. Certifications
- 12. Revision History
Figure 11.3. GITEKI Mark
11.1.7 South Korea - KC
The BGM220S22A modules have a RF certification for import and use in South-Korea.
Certification number is: R-R-BGT-BGM220S2
When integrating the RF-certified module, an end-product is exempted from doing the RF emission testing, as long as the recommen-
ded design guidance is followed, and the approved antennas are used.
EMC testing, and any other relevant test, might still be required for full compliance.
11.2 Standards-Based Certifications
11.2.1 Bluetooth Qualification
The BGM220S modules come at launch with a pre-qualified Bluetooth Low Energy RF-PHY Tested Component having Declaration ID
of D044526 and QDID of 155407, and having a listing date of 2020-09-04.
Because the validity set by the SIG for Tested Components is currently of 3 years, during the product lifetime Silicon Labs will renew
this Component as it expires, whenever applicable. Renewed Tested Components will come with new DIDs and QDIDs, and these will
be then referred to in end-product listings. Such new DIDs and QDIDs can be discovered starting from the original ones.
This module’s RF-PHY Tested Component should be combined with the latest Wireless Gecko Link Layer and Host pre-qualified Com-
ponents by Silicon Labs, when in the process of qualifying an end-product embedding the BGM220S via the SIG’s Launch Studio.
BGM220S Wireless Gecko Bluetooth Module Data Sheet
Certifications
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