Data Sheet
Table Of Contents
- 1. Features
- 2. Ordering Information
- 3. System Overview
- 4. Electrical Specifications
- 4.1 Absolute Maximum Ratings
- 4.2 General Operating Conditions
- 4.3 MCU Current Consumption at 3.0V
- 4.4 Radio Current Consumption at 3.0V
- 4.5 RF Transmitter General Characteristics
- 4.6 RF Receiver General Characteristics
- 4.7 RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps
- 4.8 RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps
- 4.9 RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps
- 4.10 RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps
- 4.11 High-Frequency Crystal
- 4.12 GPIO Pins
- 4.13 Microcontroller Peripherals
- 4.14 Typical Performance Curves
- 5. Reference Diagrams
- 6. Pin Definitions
- 7. Design Guidelines
- 8. Package Specifications
- 9. Soldering Recommendations
- 10. Tape and Reel
- 11. Certifications
- 12. Revision History
7. Design Guidelines
7.1 Layout and Placement
For optimal performance of the BGM210P,
• Place the module aligned to the edge of the application PCB, as illustrated in the figures below.
• Leave the antenna clearance area void of any traces, components, or copper on all layers of the application PCB if you are going to
use the on-board chip antenna
• Antenna clearance area is not necessary if you are using an external antenna attached to the RF pin.
• For external antenna use cases, use a 50 Ω grounded coplanar transmission line to trace the signal from the RF pin to an exter-
nal RF connector if applicable (see Figure 7.2 Recommended Layout for BGM210P Using External Antenna on page 29).
• A general rule is to use 50 Ω transmission lines where the length of the RF trace is longer than λ/16 at the fundamental frequen-
cy, which for 2.4 GHz is approximately 7.8 mm.
• A U.FL connector can be used in the host PCB for the connection to an external antenna. The use of a U.FL connector is also
recommended for conductive tests. The integrator must use a unique connector, such as a “reverse polarity SMA” or “reverse
thread SMA”, if detachable antenna is offered with the host chassis. This is especially required for the FCC and ISED approvals
to remain valid, and any other kind of direct connector to the antenna might require a permissive change.
• A trace length of 2.6 mm was used in the certifications host board to connect the module RF pin to the U.FL connector.
• For reference, Figure 7.4 RF Trace Design Example on page 30 shows a set of parameters for a 50 Ω trace. Trace impedance
should always be matched to the particular stack-up used on the host board.
• Connect all ground pads directly to a solid ground plane.
• Place the ground vias as close to the ground pads as possible.
• Do not place plastic or any other dielectric material in contact with the antenna.
Place vias close to
each of the
module’s GND pads
Place vias along all PCB edges
Wireless Module
(Top View)
GND
GND
GND
GND
GND
GND
Antenna Clearance
No metal in this area
Align module edge with PCB edge
Figure 7.1. Recommended Layout for BGM210P Using On-Board Chip Antenna
BGM210P Blue Gecko Bluetooth Module Data Sheet
Design Guidelines
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