Data Sheet
Table Of Contents
- 1. Features
- 2. Ordering Information
- 3. System Overview
- 4. Electrical Specifications
- 4.1 Absolute Maximum Ratings
- 4.2 General Operating Conditions
- 4.3 MCU Current Consumption at 3.0V
- 4.4 Radio Current Consumption at 3.0V
- 4.5 RF Transmitter General Characteristics
- 4.6 RF Receiver General Characteristics
- 4.7 RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps
- 4.8 RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps
- 4.9 RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps
- 4.10 RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps
- 4.11 High-Frequency Crystal
- 4.12 GPIO Pins
- 4.13 Microcontroller Peripherals
- 4.14 Typical Performance Curves
- 5. Reference Diagrams
- 6. Pin Definitions
- 7. Design Guidelines
- 8. Package Specifications
- 9. Soldering Recommendations
- 10. Tape and Reel
- 11. Certifications
- 12. Revision History
4. Electrical Specifications
All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:
• Typical values are based on T
A
=25 °C and VDD supply at 3.0 V, by production test and/or technology characterization.
• Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow-
er-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.
• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,
unless stated otherwise.
4.1 Absolute Maximum Ratings
Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of
the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and relia-
bility data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.
Table 4.1. Absolute Maximum Ratings
Parameter Symbol Test Condition Min Typ Max Unit
Storage temperature range T
STG
-50 — +150 °C
Voltage on any supply pin V
DDMAX
-0.3 — 3.8 V
Voltage ramp rate on VDD
supply pin
V
DDRAMPMAX
— — 1.0 V / µs
DC voltage on any GPIO pin V
DIGPIN
-0.3 — V
IOVDD
+
0.3
V
Total current into VDD power
lines
I
VDDMAX
Source — — 200 mA
Total current into GND pin I
GNDMAX
Sink — — 200 mA
Current per I/O pin I
IOMAX
Sink — — 50 mA
Source — — 50 mA
Current for all I/O pins I
IOALLMAX
Sink — — 200 mA
Source — — 200 mA
BGM210P Blue Gecko Bluetooth Module Data Sheet
Electrical Specifications
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